A single component, solvent containing, low viscosity polyimide designed for high temperature applications found in semiconductor, hybrid, optical, and medical devices. It is used mostly as a coating and dielectric layer. It can be used at high temperatures. It is a REACH compliant version of EPO-TEK OE132.

A single component, modified polyimide, high-temperature grade, silver-filled, electrically and thermally conductive adhesive designed for semiconductor die attach and hybrid microelectronic packaging.

EPO-TEK® P-1011 is a single component, modified polyimide, silver-filled adhesive designed for chip bonding in microelectronic and optoelectronic applications.

EPO-TEK® P1011S is a single component, modified polyimide, high temperature grade, silver-filled electrically and thermally conductive adhesive designed for semiconductor die-attach and hybrid microelectronic packaging.

A single component, screen printable polyimide adhesive designed for semiconductor wafer passivation applications. It is a high temperature chemistry capable of resisting >400°C seen in back-end wafer fabrication processes. Coating thicknesses of 10-90 um may be achieved. Ultra fine print definition, high Tg, low outgassing, and ionic cleanliness are a few of its traits.

EPO-TEK® TV1003 is a single component, screen printable polyimide adhesive designed for semiconductor wafer passivcation applications. It is a more insulating alternative to EPO-TEK® TV1002.

Screen printable polyimide paste for semiconductor wafer coating applications. It is a lower viscosity version of EPO-TEK® TV1003.

This data represents typical values that have been calculated from all products classified as: Generic PI, TS This information is provided for comparative purposes only.

CT4000 Series has the Highest Heat Resistivity Among Organic Material. CT4112 Lower Curing Temperature Type (JCR for automobile electoronics devices) - This can be Cured at Lower Curing Temperature (180°C) Compared with a General Polyimide Resin. - Excellent Adhesive Property to Epoxy Resin, and There are a Lot of Sales Results in the JCR Application.

CT4000 Series has the Highest Heat Resistivity Among Organic Material. CT4150 Heat Resistivity type (Heat Resistivity coating of Metal parts) - The Highest Products in terms of Heat Resistivity. - Suitable for SUS or Metal Coatings.

CT4000 Series has the Highest Heat Resistivity Among Organic Material. CT4200H Standard Type (Overcoat of the Semiconductor Device) - This is Standard Type in our Polyimide Products with High Heat Resistivity. - The Impurities are Extremely Little, and It is the Best for Overcoat of the Semiconductor Device.

"IMIDALLOY" KIR-30 is best suitable binder for Diamond grind wheel , Friction materials, etc. Strong Points - Excellent Heat resistance - Excellent Adhesion property - Excellent Moldability - Environmental friendly "IMIDALLOY" have Excellent Heat resistance and Excellent Adhesion property to organic material. We have a lot of sales performance in the grind wheel purpose.

- High temperature resistance - Strength at elevated temperature - Superior mechanical properties - High compressive strength and creep resistance - Excellent chemical resistance - Superior resistance to plasma etching - Outstanding electrical properties - Wear resistance, low friction, self-lubricating - Non-abrasive to mating parts - Extremely low moisture absorption - Radiation resistant - Compliant without deforming under load and temperature - Very low outgassing - Zero metal and mineral extractables - Extremely dimensionally stable - Equal CTE in X, Y and Z directions

- High temperature resistance - Strength at elevated temperature - Superior mechanical properties - High compressive strength and creep resistance - Excellent chemical resistance - Superior resistance to plasma etching - Outstanding electrical properties - Wear resistance, low friction, self-lubricating - Non-abrasive to mating parts - Extremely low moisture absorption - Radiation resistant - Compliant without deforming under load and temperature - Very low outgassing - Zero metal and mineral extractables - Extremely dimensionally stable - Equal CTE in X, Y and Z directions

- High temperature resistance - Strength at elevated temperature - Superior mechanical properties - Very low thermal expansion coefficient - Excellent chemical resistance - Extremely low moisture absorption - 1/16th of Vespel SP-1 - Extremely dimensionally stable - Equal thermal expansion in X, Y and Z directions - Easy machining and tolerance control - Compliant without deforming under load and temperature - Outstanding electrical properties - Wear resistance, low friction, self-lubricating - Non-abrasive to mating parts - High compressive strength and creep resistance - Very low outgassing - Zero metal and mineral extractables