Low Density & Low Hardness Thermal pad series offers a high thermal conductivity and a low thermal resistance solution. This series of products are resilient and good amount of deformation suitable for large institutional,design tolerances, Product is Low Density. The Double layer use of special ultra-thin fabric reinforcement, whether punching punch, strip type, Malformation designs may not be broken and variant. This product is one-sided self-adhesive silicone gel completely non-toxic and green products accord to international requirements

Features:
Low density
Ultra conformable
Designed for low-stress applications
Fiberglass reinforced for puncture, shear
and tear resistance