Epiall 1904B-1 is a short fiberglass reinforced epoxy molding compound, with excellent dimensional stability, good strength properties and good electrical insulation properties.

Epiall 1908-1 is a short fiberglass reinforced epoxy molding compound, with excellent dimensional stability, good strength properties and good electrical insulation properties that meets the requirements of ASTM D5948 Type GEI-5.

Epiall 1908B-1 is a short fiberglass reinforced epoxy molding compound, with excellent dimensional stability, good strength properties and good electrical insulation properties.

Epiall 1908M-1 is a short glass fiber reinforced epoxy molding compound with excellent dimensional stability, good strength properties, and good electrical insulation properties.

Epiall 1914A is a short fiberglass reinforced epoxy molding compound, with excellent dimensional stability, good strength properties and good electrical insulation properties.

Epiall 1960B-1 is a mineral and short fiberglass filled epoxy compound, formulated for the encapsulation of passive electronic devices.

Epiall 1961B-1 is a short glass fiber and mineral filled epoxy molding compound with excellent dimensional stability, good strength properties, and good electrical insulation properties.

Epiall 2061B-1 is a fiberglass and mineral reinforced epoxy molding compound, with excellent dimensional stability, good electrical insulation properties, and good strength.

SBNA INSUL-PLATE™ Hole-Fill material delivers true reliability and superior performance. This material, in powder form, is specifically suited for Hole-Fill use in glass epoxy, multi-layer and polyimide metal core circuit boards. The material is designed to meet or exceed the higher process and post-cure temperatures required for polyimide prepregs. SBNA Hole-Fill powder offers excellent adhesion to the metal core plates while maintaining the required mechanical and electrical properties. In addition, INSUL-PLATE material readily accepts plating with excellent adhesion. Vyncolit monitors the material on a lot-to-lot basis to assure a consistent product and to provide the high reliability required for metal core and multi-layer board applications.

NEONIT® K600 Fe is an iron powder-reinforced high temperature epoxy moulding compound for applications demanding heat resistance and isotrope properties and high dimension stability at a large ranche of temperature is required as and industrial equipment. Generic identification : NEOPREG K 600 Fe is an epoxy moulding compound containing 90% iron powder (according to ISO 11469: 2000)

NEONIT® K82 L8 is a long glass fiber reinforced high temp. epoxy molding compound for applications demanding heat resist., high mech. properties & long term dim. stability at high temp. (as jet engines or indus. equipment), recommended for parts with metal inserts.

NEONIT® SK60 L8F is a medium flow long glass fiber reinforced epoxy molding compound with excellent long term property retention over a wide temperature range and climate conditions. It is particularly suited for over molding.

NEONIT® SK60 L8G is a high flow long glass fiber reinforced epoxy molding compound with excellent long term property retention over a wide temperature range and climate conditions. It is particularly suited for over molding.

NEONIT® SK80 L5G is a long glass fiber reinforced epoxy molding compound with excellent long term property retention over a wide temperature range and climate conditions. It is particularly suited for over molding and manufacturing of large commutators.

NEONIT® SK80 L8G is a long glass fiber reinforced epoxy molding compound with excellent long term property retention over a wide temperature range and climate conditions. It is particularly suited for over molding and manufacturing of large commutators.

SUMIKON® EM-60 type JF black is a short fiberglass reinforced epoxy molding compound, with excellent dimensional stability, good strength properties and good electrical insulation properties.

SUMIKON® EM-61 type black is a short fiberglass reinforced epoxy molding compound, with excellent dimensional stability, good strength properties and good electrical insulation properties.

SUMIKON® EM-63 type J black is a short fiberglass reinforced epoxy molding compound, with excellent dimensional stability, good strength properties and good electrical insulation properties.

SUMIKON® EM-TX235 type black is a heat dissipative thermoset molding compounds, Non-electrical insulative(5.5W/mk) based on epoxy (TS) polymer.

Epoxy coating powder for motor Application : Slot insulation Advantage : Chemical resistance, Heat resistance

Epoxy coating powder for electrical components Application : Film capacitor Advantage : Low temp. curing, Tracking resistance

Epoxy coating powder for motor Application : Corrosion Prevention Advantage : Adhesion on metal, Thin coating

Epoxy coating powder for motor Application : Slot insulation Advantage : Heat resistance, Adhesion on metal

Epoxy coating powder for electrical components Application : Ceramic component Advantage : Humidity resistance, Thermal cycle resistance

Epoxy coating powder for electrical components Application : Ceramic component Advantage : Thermal cycle resistance, High strength, Fast cure

Epoxy coating powder for motor Application : Coil fixation Advantage : Heat resistance, Impregnation performance

Epoxy coating powder for motor Application : Slot insulation Advantage : Adhesion on metal, Thin coating, Storage stability

Separated-type liquid epoxy resin Application : Ignition coil package Advantage : Good impregnation ability

One component liquid epoxy resin Application : Ceramic filter Advantage : Low temp. curing

One component liquid epoxy resin Application : Relay Advantage : Good adhesive strength

One component liquid epoxy resin Application : Sensor Advantage : Good adhesive strength and high strength

One component liquid epoxy resin Application : Relay Advantage : Heat resistance and good adhesive strength

E-16521A is an encapsulation grade epoxy molding compound suitable for electrical applications such as coils.

E 264H is a high strength, long fiberglass reinforced epoxy molding compound, which features improved flow in transfer molding.

E 2748-9641D is a mineral and short fiberglass filled epoxy molding compound.

E 2748A is a glass reinforced epoxy molding compound, with good impact strength combined with soft flow for the encapsulation of devices requiring high quality and thermal shock resistance.

E 3812M-1 is a mineral and short fiberglass filled epoxy molding compound for low pressure encapsulation molding, featuring excellent dimensional stability, good thermal shock resistance, and good electrical insulation properties

E 3938A is a fiberglass reinforced epoxy molding compound, with excellent dimensional stability, good strength, and excellent electrical insulation properties.

EM 7459A is a medium strength fiberglass reinforced epoxy molding compound, which features enhanced impact strength and toughness

E 8353-706R is a fiberglass and mineral reinforced epoxy molding compound, with excellent dimensional stability and good strength at elevated temperatures.