Epoxy by Henkel Ablestik
Produto | Disponibilidade | Descrição do produto |
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Ablebond 7501F | Amérique du Nord | |
Ablebond 77-1S | Amérique du Nord | |
Ablebond 77-2LTC | Amérique du Nord | |
Ablebond 789-3 | Amérique du Nord |
ABLEBOND® 789-3™ die attach adhesive is designed for microelectronic applications. This adhesive exhibits strong adhesion to difficult-to-bond metals and retains its bond strength after exposure to moisture.
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Ablebond 8350M | Amérique du Nord | |
Ablebond 84-1LMI | Amérique du Nord |
ABLEBOND® 84-1LMI die attach adhesive is designed for microelectronic chip bonding. This adhesive is ideal for application by automatic dispenser or hand probe.
ABLEBOND® 84-1LMI meets the requirements of MIL-STD-883, Method 5011.
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Ablebond 84-1LMINB1 | Amérique du Nord |
ABLEBOND® 84-1LMINB1 die attach adhesive is formulated to bond difficult-to-wet surfaces such as palladium-silver capacitors terminations. This adhesive reduces capacitor shorting problems caused by resin bleed.
ABLEBOND® 84-1LMINB1 meets the requirements of MIL-STD-883, Method 5011.
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Ablebond 84-1LMISR4 | Amérique du Nord |
ABLEBOND® 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput, automatic die attach equipment. The rheology of ABLEBOND 84-1LMISR4 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems. The unique combination of adhesive properties makes this material one the most widely used die attach materials in the semiconductor industry.
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Ablebond 84-1LMIT1 | Amérique du Nord |
ABLEBOND® 84-1LMIT1 adhesive is designed for die attach applications. It is designed for screen printing using 325 mesh.
ABLEBOND® 84-1LMIT1 meets the requirements of MIL-STD-883C, Method 5011.
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Ablebond 84-3 | Amérique du Nord |
ABLEBOND® 84-3 adhesive is designed for die attach applications. This adhesive is ideal for application by automatic dispensing, screen printing or hand.
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Ablebond 85-1 | Amérique du Nord |
ABLEBOND® 85-1® adhesive is designed for hybrid applications where silver migration is a critical concern.
ABLEBOND® 85-1® meets the requirements of MIL-STD-883, Method 5011.
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Ablebond 933-1 | Amérique du Nord | |
Ablebond 958-11 | Amérique du Nord |
ABLEBOND® 958-11 adhesive is designed to absorb stresses produced when bonding large ICs.
ABLEBOND® 958-11 meets the requirements of MIL-STD-883, Method 5011.
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Ablebond 958-7 | Amérique du Nord | |
Ablebond 965-1L | Amérique du Nord |
ABLEBOND® 965-1L electrically conductive, stress-absorbing die attach adhesive is designed for bonding large die integrated circuits to substrates with mismatched coefficients of thermal expansion. ABLEBOND 965-1L adhesive exhibits very low levels of contaminants. The rheology of this adhesive is tailored for high speed,automated assembly operations. This product cures to yield a void-free bondline with minimal resin bleed.
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Ablebond 967-1 | Amérique du Nord |
ABLEBOND® 967-1™ adhesive is designed for applications which require lower-than-normal cure temperatures. It is ideal for application by automatic dispenser, screen printing, or hand probe.
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Ablebond 967-3 | Amérique du Nord |
ABLEBOND® 967-3™ adhesive is designed for applications which require lower-than-normal cure temperatures. It is ideal for application by automatic dispenser, screen printing, or hand probe. This material is a electrically insulating version of ABLEBOND 967-1 adhesive.
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Ablebond 968-2 | Amérique du Nord | |
Ablefilm 550 | Amérique du Nord |
ABLEFILM® 550™ adhesive film is designed for substrate attach and sealing microelectronic packages. This adhesive film gives off methanol, water, and ammonia during cure. Note:
Using ABLEFILM® 550™ adhesive in hermetically sealed packages is not recommended.
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Ablefilm 550K | Amérique du Nord |
ABLEFILM® 550K™ is designed for substrate attach and heat sink bonding.
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Ablefilm 561 | Amérique du Nord |
ABLEFILM® 561 glass supported, modified epoxy adhesive film is designed for bonding materials with severely mismatched coefficients of thermal expansion.
In many bonding applications, components bonded with ABLEFILM 561 adhesive film can be repaired.
After heating the component to 150°C, de-bonding can be accomplished by sliding a thin blade, such as a razor blade, between the bonded surfaces.
This adhesive film is also available in a low temperature cure version.
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Ablefilm 561K | Amérique du Nord |
ABLEFILM® 561K is designed for substrate attach and heat sink bonding. This adhesive film is designed for bonding materials with severely mismatched coefficients of thermal expansion. All data and results will vary with different thicknesses.
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Ablefilm 570 | Amérique du Nord | |
Ablefilm 570K | Amérique du Nord | |
Ablefilm ECF550 | Amérique du Nord |
Ablefilm® ECF550 silver filled, epoxy adhesive film is designed for microelectronic applications which require electrical conductivity.
When used for substrate attach, ECF550 adhesive film acts as an electrical ground plane. In the assembly or sealing of microelectronic packages which require RF shielding, ECF550 adhesive film maintains electrical continuity between joints.
Ablefilm ECF550 adhesive film provides strong adhesion to gold and other difficult-to-bond metals. After exposure to moisture, it retains its bond strength.
This adhesive film is also available in a low temperature cure version.
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Ablefilm ECF550S | Amérique du Nord |
Ablefilm® ECF550S silver filled epoxy adhesive film is designed for microelectronic applications which require electrical conductivity. This adhesive film is supported by a 3.5-mil silver screen carrier.
ECF550S adhesive film provides thermal conductivity values of 1.4 to 3.8 W/m°K, depending upon bondline pressure and initial film thickness.
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Ablefilm ECF550X | Amérique du Nord |
ABLEFILM® ECF550X silver filled, epoxy adhesive film is designed for microelectronic applications which require electrical conductivity. This material exhibits conductivity in the x, y, and z axes.
When used for substrate attach, ECF550X acts as an electrical ground plane. It provides RF/EMI shielding.
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Ablefilm ECF561 | Amérique du Nord | |
Ablefilm ECF561E | Amérique du Nord |
ABLEFILM® ECF561E electrically conductive die attach adhesive is designed for bonding materials with severely mismatched coefficients of thermal expansion. When used for substrate attach, this adhesive film acts as an electrical ground plane.
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Ablefilm ECF563 | Amérique du Nord | |
Ablefilm ECF564AHF | Amérique du Nord | |
Ablefilm ECF571 | Amérique du Nord |