CB0260 features excellent flow properties allowing it to penetrate fine pitch wires and deep cavities without entrapping voids. This product can withstand solder reflow after being exposed to JEDEC level 2 (85°C/60% RH, 168 hours) preconditioning. A cavity or potting dam is required for flow control.

CB0260-1 features excellent flow properties allowing it to penetrate fine pitch wires and deep cavities without entrapping voids. This product can withstand solder reflow after being exposed to JEDEC level 2 (85°C/60% RH, 168 hours) preconditioning. A cavity or potting dam is required for flow control.

The unique properties of CB064/FP4653 allows for it to be "chocolate breakable" on pre-scored ceramic substrate. This material is for cavity fill or dam and fill applications.

EE1068/OB4210 passes NASA outgassing standards.

EO1016 is an epoxy encapsulant intended for applications requiring excellent handling properties. The cured material survives severe thermal shock and offers continuous service to 177°C. It is particularly suited for use on transistors and similar semiconductors, can be used for encapsulation of watch ICs.

EO1060 is designed to pass 1,000 hours of temperature/humidity/bias testing and thermal cycling up to 125°C. Exceptional viscosity stability at 25°C provides easier control of shot size using conventional time/pressure dispensing equipment.

EO1061 is designed to pass 1,000 hours of temperature/humidity/bias testing and thermal cycling up to 125°C. Exceptional viscosity stability at 25°C provides easier control of shot size using conventional time/pressure dispensing equipment.

EO1072 has a unique rheology that allows the same product to be used as both a dam and fill encapsulant. It is intended for applications requiring excellent handling properties.

EO1080 epoxy encapsulant is designed for use as a casting compound in applications requiring excellent handling properties. The cured material survives severe thermal shock and offers continuous service to 177°C.

EO1088 epoxy encapsulant particularly suited for use on transistors and similar semiconductors,and can be used for encapsulation of watch ICs. The cured material survives severe thermal shock and offers continuous service to 177°C. Product Benefits - Excellent shelf stability - Excellent handling properties - Fast curing capability at moderate temperature

EO7039 encapsulant is designed for attachment of integrated circuits and components to advanced flexible substrates. This material is formulated to produce a void-free bond line with excellent interfacial adhesive strength to a wide variety of organic substrates and various metal surfaces.

HYSOL® ES1000™ is a two-component, long pot life, casting system with excellent handling properties. This low cost, flexible system is filled with a non-abrasive filler for machine metering/dispensing. This material has good thermal shock resistance and low exotherm, making it suitable for encapsulation of various components and modules.

HYSOL® ES1002™ is a two-component casting system with excellent handling properties. This low cost, flexible system is filled with a non-abrasive filler for machine metering/dispensing or regular hand mixer applications.

Casting compound, ES1004™ has been formulated to meet the needs for flame-out, easily handled casting systems. The cured system is non-burning of self-extinguishing according to ASTM D 635 and meets UL requirements for 94V-0.

HYSOL® ES1301™ is a silica filled epoxy casting system recommended for coils, transformers, and general pupose casting.

HYSOL® ES1900™ is a transparent, medium-viscosity epoxy resin formulation recommended for small potting and laminating applications where clarity and excellent structural, mechanical and electrical properties are required. This two-part adhesive exhibits good wetting, cures at room temperature and develops strong, low shrinkage bonds to most materials including optical fibers, glass ceramics, most metals and many rigid plastics. It has excellent dimensional stability over a wide temperature range. Fully cured, it is a durable electrical insulator with good physical properties, and excellent chemical resistance. This product is typically used in applications with an operating range of -60°C to +125°C.

HYSOL® ES1901™ is a fast-setting, thoughened, medium viscosity, industrial grade epoxy adhesive. Once mixed, the two-component epoxy cures at room temperature with low shrinkage and forms an ultra clear bondline with excellent peel resistance. When fully cured, the epoxy is resistant to a wide range of chemicals and solvents, and acts as an excellent electrical insulator. HYSOL® ES1901™ is ideal for bonding plastic, metal, glass, wood, ceramic, rubber, and masonry materials where flexibility is needed. Designed for a variety of applications such as flex circuits, cable boots, and staking fillet bonds. This material is well suited for applications that require an ultraclear bondline.

ES1902 UV epoxy is a transparent, low viscosity epoxy resin formulation recommended for potting and laminating applications where low color and excellent electrical and mechanical properties are required. This two-part adhesive exhibits a fast UV gellation, a room temperature cure and develops strong, low shrinkage, bonds to most metals and many rigid plastics. It has excellent dimensional stability over a wide temperature range.

HYSOL® ES2202™ is an unfilled epoxy system with a high operating temperature and long pot life. It is recommended for use where excellent chemical resistance, high heat distortion temperature and good electrical properties under high humidity conditions are required. This product is recommended for servo stators, high temperature resistors, transformers, and high temperature cast shapes.

HYSOL® ES2207™ is a filled, resilient, low viscosity, room temperature cure epoxy potting compound. This material has excellent adhesion to many substrates, and has good surface appearance. It will meet UL 94 V-0 requirements in 1/8 inch thickness.

HYSOL® ES2500™ is a resilient, low cost, fast gelling, potting compound. Designed for easy 2 to 1 meter-mix-dispense machinery and low abrasion. This material is ideal for potting and encapsulating high volume parts. HYSOL® ES2500™ meets UL 94 HB Flame Retardant to 1.5mm thickness.

FP0087 yields best results when used to encapsulate a device enclosed in a cavity or potting ring, which restricts the flow of the material. The unique combination of low stress and excellent resistance to moisture and process fluids provide excellent results in severe automotive environments.

FP4450 encapsulant is designed for protection of bare semiconductor devices. It offers pressure pot performance on live devices up to 500 hours with no failures, depending upon the device and package type. A cavity or potting dam is required for flow control.

FP4450HF encapsulant is designed for protection of bare semiconductor devices. Autoclave performance on live devices is greater than 1,000 hours with no failure, depending upon device and package type. The use of synthetic fused silica yields alpha particle emissions suitable for memory devices. A cavity or potting dam is required for flow control.

FP4450LV™ encapsulant is designed for protection of bare semiconductor devices. Autoclave performance on live devices is greater than 1,000 hours with no failure, depending upon device and package type. A cavity or potting dam is required for flow control.

FP4451 damming material is designed as a flow control barrier around areas of bare chip encapsulation. FP4451 used in combination with FP4450, FP4451 and other Henkel encapsulants passes pressure pot performance on live devices up to 500 hours with no failures depending on device and package type.

FP4451TD damming material is designed as a flow control barrier around areas of bare chip encapsulation.

FP4460 encapsulant is designed for protection of bare semiconductor devices. Pressure pot performance on live devices is up to 500 hours with no failures, depending on device and package type.

FP4651 epoxy encapsulant features very low thermal expansion while retaining syringe dispense capabilities. Its low viscosity and 50 micron maximum particle size gives it improved handling properties over FP4650 for fine wire pitch and cavity-fill applications. It is based on FP4450 resin chemistry, therefore exhibiting excellent chemical resistance and thermal stability properties.

FP4652 is based on the same chemistry as the FP4451 and, therefore, is completely compatible. Its low viscosity and micron maximum particle size make it ideal for devices with fine pitch wire spacing. Dam and fill materials should be co-cured to obtain best results. Product Benefits - High purity - Self-leveling - Low stress - Low viscosity

FP4654 encapsulant is designed for larger cavity-fill or dam-and-fill applications.

FP6401 damming material is designed as a flow control barrier around areas of bare chip encapsulation. Its extremely low modulus makes it ideal for the protection of devices that are stress sensitive or that have tight coplanarity requirements. It should be co-cured with the encapsulant material. FP6401 exhibits high adhesion to flexible and rigid circuit substrates. Product Benefits - High purity - Liquid flexible - Low viscosity - High thixotropy - Minimal slumping - Low modulus

GR2820 epoxy molding compound delivers outstanding performance and ease of use. This material is designed to achieve JEDEC Level 1 requirements, at 260°C reflow temperature. GR2820 meets UL 94 V-0 Flammability at 6.35mm thickness. Product Benefits - Green product - Optimum performance - Thin wall crack resistance - Low stress - Low moisture absorption - High moldability - Fast cycle time - Lasermark capability

Hysol® GR750HT-25™ is an epoxy molding compound designed to improve thermal management in semiconductor devices. GR750HT-25™ meets UL 94 V-0 Flammability at 3.175mm thickness. Product Benefits - Green product - High thermal conductivity - High adhesion

Hysol® GR750-SC™ is an epoxy molding compound designed to improve thermal management in semiconductor devices. Product Benefits - Green product - High thermal conductivity - High adhesion

Hysol® GR750™ is an epoxy molding compound designed to improve thermal management in semiconductor devices. GR750™ meets UL 94 V-0 Flammability at 3.175mm thickness. Product Benefits - Green product - High thermal conductivity - High adhesion - Low moisture absorption - Low thermal expansion

Hysol® GR828D™ targets leadframe packages that require high levels of Ag adhesion retention after the MSL soak and IR reflow process. This material is designed to achieve JEDEC Level 1 requirements, at 260°C reflow temperature. GR828D™ meets UL 94 V-0 Flammability at 3.175mm thickness. Product Benefits - Green product - Low stress - High adhesion - Excellent adhesion to Ag plated LF

GR869 is a green semiconductor grade molding compound especially designed for SOIC, TSOP and QFP packages with Ni/Pd and copper leadframes. It offers much improved JEDEC performance as well as moldability property. GR869 meets UL 94 V-0 Flammability at 3.175mm thickness. Product Benefits - Green product - Low stress - High adhesion - Low moisture absorption - Excellent solder reflow resistance - High moldability

Huawei KL-G800H epoxy molding compound is suitable for thin leaded package without any flame retardant.. This material is designed to achieve JEDEC Level 2 requirements, at 260°C reflow temperature.

Hysol® KL-2500-1K™ is a low thermal expansion and low stress molding compound suitable for GBU, KBU, TO, ZIP, SIP, DIP and SDIP packages, providing superior moldability and reliability. Applications - Semiconductor Molding Compounds - Through-Hole Discretes