Epoxy resin moulding composition filled with inorganic resin carriers Increased thermal conductivity, very good electrical insulation properties and dimensional stability at high temperatures, excellent crack resistance to temperature changes/shock, very low ion content, isotropic properties Low stress encapsulation of sensitive electronic components, especially PCBA's. Furthermore, windings (stator and rotor), magnets and primary insulation of yoke teeth in e-mobility, where improved heat dissipation is required This product meets the allowed upper limits for heavy metals and PCAs and also conforms to the requirements of the EU directives RoHS 2, 2002/96 (WEEE) and 2006/122 (PFOS)

Glass-fibre and inorganic reinforced epoxy moulding compound High thermal conductivity, good mechanical strength, very good electrical isolation properties and dimensional stability at high temperatures, excellent cracking resistance regarding thermal shock stress Encapsulation of very sensitive electronic components where improved heat dissipation is required, in particular rotors and stators. This product meets the allowed upper limits for heavy metals and PCAs and also conforms to the requirements of the EU directives RoHS 2, 2002/96 (WEEE) and 2006/122 (PFOS)

Glass-fibre reinforced epoxy moulding compound Good mechanical strength, very good electrical isolation properties and dimensional stability even at high temperatures Primary application(s): Connectors, Thermocouples, Sensors, Resistors, Potentiometers This product meets the allowed upper limits for heavy metals and PCAs and also conforms to the requirements of the EU directives 2002/95 (RoHS), 2002/96 (WEEE) and 2006/122 (PFOS)

Mineraly reinforced epoxy resin moulding composition User-friendly and easy to use, simple moulding and easy demoulding, short curing time, very good polishability with excellent surface quality, very low shrinkage and therefore gap-free embedding, free from bisphenols and halogenated acid anhydrides Application: Hot mount of metallic materials for metallography resulting in a better mount with outstanding edge retention This product meets the allowed upper limits for heavy metals and PCAs and also conforms to the requirements of the EU directives RoHS 2, 2002/96 (WEEE) and 2006/122 (PFOS)

Glass-fibre and inorganic reinforced epoxy moulding compound Good mechanical strength, very good electrical isolation properties and dimensional stability even with thin wall thickness and high temperatures, very good sealing connection on metal and EPOXIDUR EP 3580 T part surfaces Fluidproof encapsulation of electromagnetic coils, coil bodys and rectifiers This product meets the allowed upper limits for heavy metals and PCAs and also conforms to the requirements of the EU directives RoHS 2, 2002/96 (WEEE) and 2006/122 (PFOS)

Glass-fibre and inorganic reinforced epoxy moulding compound Good mechanical properties, very good electrical insulation properties and dimensional stability at high temperatures, good sealing connection on metal surfaces, excellent crack resistance under thermal shock stress, very low ion content Mediumproof encapsulation sensors, printed circuit boards and electronic components in the automotive industry with increased demand on resistance to thermal, chemical and hydrolytic influences This product meets the allowed upper limits for heavy metals and PCAs and also conforms to the requirements of the EU directives RoHS 2, 2002/96 (WEEE) and 2006/122 (PFOS)

Glass-fibre reinforced and inorganically filled epoxy moulding compound Good mechanical strength, very good electrical isolation properties and dimensional stability even at high temperatures Moulding compound with a broad spectrum of applications This product meets the allowed upper limits for heavy metals and PCAs and also conforms to the requirements of the EU directives 2002/95 (RoHS), 2002/96 (WEEE) and 2006/122 (PFOS)

Glass-fibre reinforced and inorganically filled epoxy moulding compound Good mechanical strength, very good electrical isolation properties and dimensional stability, excellent cracking resistance regarding thermal shock stress, outstanding heat resistance (Automotive-)fluidproof encapsulation of sensitive electrical components This product meets the allowed upper limits for heavy metals and PCAs and also conforms to the requirements of the EU directives 2002/95 (RoHS), 2002/96 (WEEE) and 2006/122 (PFOS)

Glass-fibre reinforced and inorganically filled epoxy moulding compound Good mechanical strength, very good electrical isolation properties and dimensional stability even at high temperatures, excellent cracking resistance regarding thermal shock stress Rotors, magnetic coil coatings This product meets the allowed upper limits for heavy metals and PCAs and also conforms to the requirements of the EU directives 2002/95 (RoHS), 2002/96 (WEEE) and 2006/122 (PFOS)

Glass-fibre and inorganic reinforced epoxy moulding compound Good mechanical properties, very good electrical insulation properties and dimensional stability at high temperatures, good sealing connection on metal surfaces, excellent crack resistance under thermal shock stress, very low ion content, predominantly isotropic properties Mediumproof encapsulation of pressure- and stress-sensitive sensors, printed circuit boards and electronic components in the automotive industry with increased demand on resistance to thermal, chemical and hydrolytic influences This product meets the allowed upper limits for heavy metals and PCAs and also conforms to the requirements of the EU directives RoHS 2, 2002/96 (WEEE) and 2006/122 (PFOS)

Glass-fibre and inorganic reinforced epoxy moulding compound with very low ion content Good mechanical properties, very good electrical insulation properties and dimensional stability at high temperatures, good sealing connection on metal surfaces and EPOXIDUR EP 3685 T part surfaces, excellent crack resistance under thermal shock stress Mediumproof encapsulation of sensors, printed circuit boards and electronic components in the automotive industry with increased demand on resistance to thermal, chemical and hydrolytic influences This product meets the allowed upper limits for heavy metals and PCAs and also conforms to the requirements of the EU directives RoHS 2, 2002/96 (WEEE) and 2006/122 (PFOS)