High Reliable and Easy-to-Use Molding Compounds for Various Type of Packages Strong Points - Provide Various Molding Compounds with High Reliability to Cover Many Applications such as LSI, Transistors and Diodes. - Good Curability and Applicable to Various Molding Machines (Both Automated and Conventional) - Low Stress of Large chips and Applicable to Encapsulation. Application Smaller SOP, Smaller QFP, DIP, SIP/ZIP, TO-PKG, DPAK, SOT, Unbalanced PKG, Module

Molding Compounds for Area Array Packages (BGA, CSP etc.) Special Epoxy Molding Compounds Optimizing Warpage and Applicable to Fine Pitch Wire for BGA Package Strong Points - Less Warpage in All Types of Area Array Packages due to High Tg Characteristic. - Applicable to Fine Pitch Wire Bonding with Good Wire Sweep Performance. - Achieve High Yield after Molding due to Excellent Moldability that allows its application to MAP. Application - Standard P-BGA, HS-BGA and LGA Package. - Multi Chip Module (Stacked or Side by Side Layout) - IC Card, Memory Card etc. Low Alpha Ray Type: KE-2100A-S3

Special Epoxy Molding Compounds Optimizing Warpage and Applicable to Fine Pitch Wire for BGA Package Strong Points - Less Warpage in All Types of Area Array Packages due to High Tg Characteristic. - Applicable to Fine Pitch Wire Bonding with Good Wire Sweep Performance. - Achieve High Yield after Molding due to Excellent Moldability that allows its application to MAP. Application - Standard P-BGA, HS-BGA and LGA Package. - Multi Chip Module (Stacked or Side by Side Layout) - IC Card, Memory Card etc. Low Alpha Ray Type: KE-2150

We have several grades of compounds w/good balance between cost and performance to meet wide requirements of customers. Strong Points - Good Adhesion Strength even Under High Temperature Reflow Soldering Process. - Achieve Good Reflow Resistance (JEDEC Level 2) with Good Moldability. - JEDEC Level 1 in Case Smaller Package is possible. - Line Up for Several Lead Frame Types. (Cu,42Alloy,Pd/Au plated) Application SOP, Larger QFP, Smaller QFP, DIP, TO-PKG, DPAK, SOT

We have several grades of compounds w/good balance between cost and performance to meet wide requirements of customers. Strong Points - Good Adhesion Strength even Under High Temperature Reflow Soldering Process. - Achieve Good Reflow Resistance (JEDEC Level 2) with Good Moldability. - JEDEC Level 1 in Case Smaller Package is possible. - Line Up for Several Lead Frame Types. (Cu,42Alloy,Pd/Au plated) Application SOP, Larger QFP, Smaller QFP, DIP, TO-PKG, DPAK, SOT

High Reliable and Easy-to-Use Molding Compounds for Various Type of Packages Strong Points - Provide Various Molding Compounds with High Reliability to Cover Many Applications such as LSI, Transistors and Diodes. - Good Curability and Applicable to Various Molding Machines (Both Automated and Conventional) - Low Stress of Large chips and Applicable to Encapsulation. Application Smaller SOP, Smaller QFP, DIP, SIP/ZIP, TO-PKG, DPAK, SOT, Unbalanced PKG, Module

Achieved Fast Cure for In-Line Process as well as Excellent Fillings and Applicable from Insertion Type to Surface Mount Type. Strong Points - Achieve Good and Necessary Filling in KE-520Series to Apply to Ultra Small Packages. - JEDEC level 1 is Possible in Ultra Small Packages. - Good Adhesion Strength Even after High Temperature Reflow Soldering Process. - Fast Cure Enabling High Productive In-Line Auto Process. - Excellent moldability and show improvement in moldability yield. Application - Surface Mount Device - TO-92 Type (Insertion Type) - Ultrasmall PKG

High Reliable and Easy-to-Use Molding Compounds for Various Type of Packages Strong Points - Provide Various Molding Compounds with High Reliability to Cover Many Applications such as LSI, Transistors and Diodes. - Good Curability and Applicable to Various Molding Machines (Both Automated and Conventional) - Low Stress of Large chips and Applicable to Encapsulation. Application Smaller SOP, Smaller QFP, DIP, SIP/ZIP, TO-PKG, DPAK, SOT, Unbalanced PKG, Module

We have several grades of compounds w/good balance between cost and performance to meet wide requirements of customers. Strong Points - Good Adhesion Strength even Under High Temperature Reflow Soldering Process. - Achieve Good Reflow Resistance (JEDEC Level 2) with Good Moldability. - JEDEC Level 1 in Case Smaller Package is possible. - Line Up for Several Lead Frame Types. (Cu,42Alloy,Pd/Au plated) Application SOP, Larger QFP, Smaller QFP, DIP, TO-PKG, DPAK, SOT

High Reliable and Easy-to-Use Molding Compounds for Various Type of Packages Strong Points - Provide Various Molding Compounds with High Reliability to Cover Many Applications such as LSI, Transistors and Diodes. - Good Curability and Applicable to Various Molding Machines (Both Automated and Conventional) - Low Stress of Large chips and Applicable to Encapsulation. Application Smaller SOP, Smaller QFP, DIP, SIP/ZIP, TO-PKG, DPAK, SOT, Unbalanced PKG, Module

Increase the freedom of designing and provides superior cost performance. Features - Least anisotropic structure, high dimensional accuracy molded parts - High mechanical modulus, lower deflection molded parts - Excellent electrical properties, especially good insulation properties, excellent heat resistant, excellent moldability, excellent storage behavior Application - Optical fiber connector components - Printer parts

Achieved Fast Cure for In-Line Process as well as Excellent Fillings and Applicable from Insertion Type to Surface Mount Type. Strong Points - Achieve Good and Necessary Filling in KE-520Series to Apply to Ultra Small Packages. - JEDEC level 1 is Possible in Ultra Small Packages. - Good Adhesion Strength Even after High Temperature Reflow Soldering Process. - Fast Cure Enabling High Productive In-Line Auto Process. - Excellent moldability and show improvement in moldability yield. Application - Surface Mount Device - TO-92 Type (Insertion Type) - Ultrasmall PKG

Developed for Power Device Package that needs Good Heat Dissipation Through Molding Compound. Strong Points - High Thermal Conductivity with Good Moldability, Excellent Moisture Resistance and Low Stress. - Used in Auto Molding System by Rapid Cure Grades. - KE-870 and KE-880 is Formulated with Special High Thermal Conductivity Filler System and Achieve High Thermal Conductivity (above 3W/m K). Application - Isolation Packages such as TO-220 and TO-3P that need Heat Dissipation Characteristics. - Packages for High Heating Volume such as Power Module.

Developed for Power Device Package that needs Good Heat Dissipation Through Molding Compound. Strong Points - High Thermal Conductivity with Good Moldability, Excellent Moisture Resistance and Low Stress. - Used in Auto Molding System by Rapid Cure Grades. - KE-870 and KE-880 is Formulated with Special High Thermal Conductivity Filler System and Achieve High Thermal Conductivity (above 3W/m K). Application - Isolation Packages such as TO-220 and TO-3P that need Heat Dissipation Characteristics. - Packages for High Heating Volume such as Power Module.

Developed for Power Device Package that needs Good Heat Dissipation Through Molding Compound. Strong Points - High Thermal Conductivity with Good Moldability, Excellent Moisture Resistance and Low Stress. - Used in Auto Molding System by Rapid Cure Grades. - KE-870 and KE-880 is Formulated with Special High Thermal Conductivity Filler System and Achieve High Thermal Conductivity (above 3W/m K). Application - Isolation Packages such as TO-220 and TO-3P that need Heat Dissipation Characteristics. - Packages for High Heating Volume such as Power Module.

Developed for Power Device Package that needs Good Heat Dissipation Through Molding Compound. Strong Points - High Thermal Conductivity with Good Moldability, Excellent Moisture Resistance and Low Stress. - Used in Auto Molding System by Rapid Cure Grades. - KE-870 and KE-880 is Formulated with Special High Thermal Conductivity Filler System and Achieve High Thermal Conductivity (above 3W/m K). Application - Isolation Packages such as TO-220 and TO-3P that need Heat Dissipation Characteristics. - Packages for High Heating Volume such as Power Module.

Special Epoxy Molding Compounds Optimizing Warpage and Applicable to Fine Pitch Wire for BGA Package Strong Points - Less Warpage in All Types of Area Array Packages due to High Tg Characteristic. - Applicable to Fine Pitch Wire Bonding with Good Wire Sweep Performance. - Achieve High Yield after Molding due to Excellent Moldability that allows its application to MAP. Application - Standard P-BGA, HS-BGA and LGA Package. - Multi Chip Module (Stacked or Side by Side Layout) - IC Card, Memory Card etc. Low Alpha Ray Type: KE-G2200

Special Epoxy Molding Compounds Optimizing Warpage and Applicable to Fine Pitch Wire for BGA Package Strong Points - Less Warpage in All Types of Area Array Packages due to High Tg Characteristic. - Applicable to Fine Pitch Wire Bonding with Good Wire Sweep Performance. - Achieve High Yield after Molding due to Excellent Moldability that allows its application to MAP. Application - Standard P-BGA, HS-BGA and LGA Package. - Multi Chip Module (Stacked or Side by Side Layout) - IC Card, Memory Card etc. Low Alpha Ray Type: KE-G2250 LKDS

Special Epoxy Molding Compounds Optimizing Warpage and Applicable to Fine Pitch Wire for BGA Package Strong Points - Less Warpage in All Types of Area Array Packages due to High Tg Characteristic. - Applicable to Fine Pitch Wire Bonding with Good Wire Sweep Performance. - Achieve High Yield after Molding due to Excellent Moldability that allows its application to MAP. Application - Standard P-BGA, HS-BGA and LGA Package. - Multi Chip Module (Stacked or Side by Side Layout) - IC Card, Memory Card etc. Low Alpha Ray Type: KE-G2270

High Reliable and Easy-to-Use Molding Compounds for Various Type of Packages Strong Points - Provide Various Molding Compounds with High Reliability to Cover Many Applications such as LSI, Transistors and Diodes. - Good Curability and Applicable to Various Molding Machines (Both Automated and Conventional) - Low Stress of Large chips and Applicable to Encapsulation. Application Smaller SOP, Smaller QFP, DIP, SIP/ZIP, TO-PKG, DPAK, SOT, Unbalanced PKG, Module

High Reliable and Easy-to-Use Molding Compounds for Various Type of Packages Strong Points - Provide Various Molding Compounds with High Reliability to Cover Many Applications such as LSI, Transistors and Diodes. - Good Curability and Applicable to Various Molding Machines (Both Automated and Conventional) - Low Stress of Large chips and Applicable to Encapsulation. Application Smaller SOP, Smaller QFP, DIP, SIP/ZIP, TO-PKG, DPAK, SOT, Unbalanced PKG, Module

Frontier of Environment-Friendly Materials! Full Lineup of Flame Retardant-free Compounds Strong Points - Line Up for Several Lead Frame Types. (Cu,42Alloy,Pd/Au plated) - All of Lineup w/ No Flame Retardant Compounds are Highly Reliable. - KE-G3000 Series and KE-G280 Series Possess Top Ranked Reliability Especially in Reflow Resistance under Pb Free Condition. Application - TSOP, SOP, Larger QFP, Smaller QFP, DIP

Frontier of Environment-Friendly Materials! Full Lineup of Flame Retardant-free Compounds Strong Points - Line Up for Several Lead Frame Types. (Cu,42Alloy,Pd/Au plated) - All of Lineup w/ No Flame Retardant Compounds are Highly Reliable. - KE-G3000 Series and KE-G280 Series Possess Top Ranked Reliability Especially in Reflow Resistance under Pb Free Condition. Application - TSOP, SOP, Larger QFP, Smaller QFP, DIP

Frontier of Environment-Friendly Materials! Full Lineup of Flame Retardant-free Compounds Strong Points - Line Up for Several Lead Frame Types. (Cu,42Alloy,Pd/Au plated) - All of Lineup w/ No Flame Retardant Compounds are Highly Reliable. - KE-G3000 Series and KE-G280 Series Possess Top Ranked Reliability Especially in Reflow Resistance under Pb Free Condition. Application - TSOP, SOP, Larger QFP, Smaller QFP, DIP

Frontier of Environment-Friendly Materials! Full Lineup of Flame Retardant-free Compounds Strong Points - Line Up for Several Lead Frame Types. (Cu,42Alloy,Pd/Au plated) - All of Lineup w/ No Flame Retardant Compounds are Highly Reliable. - KE-G3000 Series and KE-G280 Series Possess Top Ranked Reliability Especially in Reflow Resistance under Pb Free Condition. Application - TSOP, SOP, Larger QFP, Smaller QFP, DIP

Frontier of Environment-Friendly Materials! Full Lineup of Flame Retardant-free Compounds Strong Points - Line Up for Several Lead Frame Types. (Cu,42Alloy,Pd/Au plated) - All of Lineup w/ No Flame Retardant Compounds are Highly Reliable. - KE-G3000 Series and KE-G280 Series Possess Top Ranked Reliability Especially in Reflow Resistance under Pb Free Condition. Application - TSOP, SOP, Larger QFP, Smaller QFP, DIP