E-Pos 101X75 is a low molecular weight solid epoxy resin based on bisphenol A and epichlorohydrin. It is supplied as 75% m/m solids in xylene. E-Pos 101X75 is a high quality resin showing a homogeneous molecular weight distribution. Product applications E-Pos 101X75 is used at room temperature in combination with amine- or amide-based curing agents in the formulation of high quality two-component solventborne coatings. Thanks to its excellent mechanical and chemical properties, E-Pos 101X75 is ideal for application on concrete, for example in sealer formulations, or for metal protection. E-Pos 101X75 enables the formulation of industrial paints exhibiting high corrosion and chemical resistance and provides excellent substrate adhesion.

Product description E-Pos 327H is a non diluted bisphenol A based epoxy resin with a relatively low viscosity. Applications E-Pos 327H is used at room temperature in combination with amine-based curing agents in the formulation of two-component reactive systems. Systems based on E-Pos 327H exhibit superior mechanical and chemical resistance properties as well as an excellent heat resistance. The slightly lower viscosity of E-Pos 327H compared to standard bisphenol A-based resins allows the formulation of systems with higher pigment and/or filler loadings. E-Pos 327H can be used in a variety of applications in the field of civil engineering such as floorings or adhesives, in the formulation of solventfree or high-solids coatings, in composite applications, in electronic such as laminates en in thermal and electrical isolation applications.

E-Pos 328 is a medium viscosity epoxy resin, based on bisphenol A and epichlorohydrin. E-Pos 328 does not contain any diluent. E-Pos 328 exhibits superior mechanical and chemical resistance properties and an excellent resistance to heat. Product applications E-Pos 328 is used at room temperature in combination with amine-based curing agents in the formulation of two-component systems. E-Pos 328 can be used in civil engineering applications such as floorings, mortars or solventfree adhesives. It can also be used in composites and in electrical and electronic applications.

E-Pos 362 is a low viscosity epoxy resin, based on Bisphenol F and epichlorohydrin. This resin does not contain any diluent. E-Pos 362 exhibits superior mechanical and chemical resistance properties and excellent heat resistance. The low viscosity of E-Pos 362 ensures excellent pigment and substrate wetting characteristics. E-Pos 362 is usually used in mixture with other epoxy resins, either to diminish their viscosity or to provide crystallisation resistance. Pure E-Pos 362 tends to crystallise. Product applications E-Pos 362 resin is used alone or in a admixture at room temperature in combination with amine-based curing agents in the formulation of two-component systems. It is typically used in civil engineering applications such as solventfree floorings, mortars or adhesives. It can also be used in composite applications such as filament winding and in electrical and electronic applications.

E-Pos 433 is a non diluted epoxy resin which is based on a mixture of Bisphenol A-based epoxy resin and Bisphenol F-based epoxy resin. E-Pos 433 is crystallisation-resistant. Product applications E-Pos 433 is used at room temperature in combination with amine-based curing agents in the formulation of two-component reactive systems. The low viscosity of E-Pos 433 combined to a good mechanical and chemical resistance allows its use in various applications such as solventfree coatings, civil engineering (mortars, adhesives), composites (filament winding) or electrical (insulation).

E-Pos 514 is a low viscosity epoxy resin based on Bisphenol A en epichlorohydrin, which is diluted with an aliphatic monoglycidyl ether reactive diluent. The low viscosity of E-Pos 514 ensures excellent pigment and substrate wetting. Product applications E-Pos 514 is used at room temperature in combination with amine-based curing agents in the formulation of two-component reactive systems. The good balance of properties which can be obtained with E-Pos 514 and its low viscosity allow its use in various civil engineering applications such as self-leveling or trowellable floorings, mortars, castings, adhesives, in solventfree or high-solids coatings or in the preparation of laminates.

E-Pos 530 is a new low viscosity bisphenol A epoxy resin diluted with an epoxidised alkyl phenol of natural source. Product characteristics E-Pos 530 exhibits low volatility and excellent crystallisation resistance. The low viscosity of the resin allows high filler loading and ensures good wetting thereof and of the substrate. The reactive diluent contained in the resin also acts as a flexibiliser, improving the mechanical properties, e.g. the impact resistance of the resin. E-Pos 530 shows excellent water and chemical resistance, excellent dimensional stability as well as maintained electrical characteristics. Product applications E-Pos 530 is used in combination with amine-based curing agents in the formulation of two-pack ambient curing systems. The good balance of properties which can be obtained with E-Pos 530 allows its use in various civil engineering applications such as floorings, mortars, grouts, laminates, adhesives, but also for the production of electrical castings and of solvent-free coatings.

E-Pos 540 is a low viscosity epoxy resin comprising a Bisphenol A/Bisphenol F resin blend and diluted with an epoxidised alcohol-type monofunctional reactive diluent. Applications E-Pos 540 is used in combination with amine-based curing agents in the formulation of two-pack ambient curing systems. E-Pos 540 does not crystallise upon storage. The low viscosity of the resin allows the use of high concentrations of pigments and/or fillers and systems based on E-Pos 540 show excellent compatibility with a variety of components, which renders this resin ideal for use in civil engineering applications such as self-leveling floorings, trowellable floorings or mortars and in solventfree or high-solids coatings as well as in adhesives.

E-Pos 542 is a low viscosity epoxy resin which is based on bisphenol A and bisphenol F and which is diluted with an epoxidised alcohol reactive diluent. Product applications E-Pos 542 epoxy resin is used at room temperature in combination with amine-based curing agents in the formulation of two-component systems. E-Pos 542 resists to crystallization during storage. The low viscosity of the resin allows high pigment and/or filler loadings and systems based on E-Pos 542 show excellent compatibility with a variety of components. For these reasons, that resin is ideal for use in various civil engineering applications such as self-leveling and trowellable floorings, mortars as well as in the formulation of solventfree or high-solids coatings and also in adhesives.

E-Pos 558 is a low viscosity epoxy resin based on Bisphenol A and Bisphenol F and diluted with a difunctional reactive diluent. E-Pos 558 is crystallisation-resistant. Product applications E-Pos 558 is used in combination with amine-based curing agents in the formulation of two-pack ambient curing systems. E-Pos 558 enables the preparation of systems providing excellent chemical resistance. E-Pos 558 can be used in civil engineering applications such as sealers, self-leveling floorings, trowellable floorings or mortars, but also in the formulation of solventfree coatings exhibiting a good resistance to chemicals.

E-Pos 562 is a low viscosity bisphenol A-based epoxy resins which is diluted with a bifunctional reactive diluent. Product applications E-Pos 562 is used in combination with amine-based curing agents in the formulation of two-pack ambient curing systems. E-Pos 562 enables the formulation of systems exhibiting high chemical resistance. This resin can be used in civil engineering applications such as self-leveling floorings, trowellable floorings or mortars and in the formulation of solventfree paints resisting to chemical agents.

E-Pos 674X90 is a semi-solid modified bisphenol A-based epoxy resin in xylene solution (90% m/m resin in xylene). E-Pos 674X90 has been developed for use in high-solids applications and is characterized by a high degree of flexibility and a reduced solution viscosity. Product applications E-Pos 674X90 is used at room temperature in combination with amine-based curing agents in the formulation of two-component systems. This resin has specifically been developed for use in high-solids coatings for metal or concrete protection. E-Pos 674X90 enables the formulation of anticorrosive paints with a solids content of up to 85% m/m at application viscosity. Compared to solventborne resins, E-Pos 674X90 has a low solution viscosity, allowing for high pigment and/or filler loading, and exhibits excellent flexibility and impact resistance. This combination renders this resin ideal for use in metal primers as well as in protective top-coats.

E-Pos 941 is a cycloaliphatic epoxy resin for heat cure applications, which can be cured with carboxylic acid anhydrides, with or without catalyst, to produce systems for electrical applications, in particular for outdoor use. Product applications E-Pos 941 is used in solventfree systems for the preparation of electrical elements, in particular for outdoor applications with exposition to severe climate conditions. This heat curing product has also been developed for metal insulation, casting of electrical insulators, transformers insulation, etc. The resin shows an excellent arc resistance and outstanding mechanical, thermal and electrical properties. The system should be cured in an oven, under vacuum, at a temperature of typically 70°C to 100°C, but which can go up to 140°C-150°C.