Greene Tweed’s Chemraz ® 615 exhibits outstanding high temperature properties, with a temperature range from 0°F to 615°F (-18°C to 324°C). Chemraz ® 615’s chemical resistance and low compression set characteristics combine to out perform tin-cured FFKMs. Chemraz ® 615 shows lower compression set at high temperatures and a higher retained sealing force than other available FFKMs. Because Chemraz ® 615 allows for the use of higher process operating temperatures, it is ideal for a range of markets, from chemical process to petroleum refining. This superior FFKM performs well in a variety of fluids, such as inorganic and organic chemicals, acids, reagents, heat transfer fluids, and hydrocarbons. Chemraz ® 615 is available in standard o-rings and custom shapes for a range of equipment, from pumps and valves to agitators and mixers, from mechanical seals and process control instruments to heat exchangers and diagnostic equipment.

Chemraz ® 629 FFKM is specifically developed by Greene Tweed to meet the rigorous demands of aggressive plasma systems. Its unique formulation provides enhanced plasma resistance in oxygen and fluorine plasma processes, resulting in minimal contamination, less downtime, and higher wafer processing yields. Chemraz ® 629 is developed from an advanced polymer using fluoro-polymer nano-composite technology particles. Recommended for both static and dynamic dry wafer processing applications such as etch, remote plasma cleans, and deposition (CVD, HDPCVD) with challenging gland designs and reduced sealing loads, it remains stable at service temps to 500°F (260°C).

Chemraz ® 639 perfluoroelastomer is specifically developed by Greene Tweed to meet the rigorous demands of aggressive plasma systems. Its unique formulation provides enhanced plasma resistance in oxygen and fluorine plasma processes, resulting in minimal contamination, less downtime, and higher wafer processing yields. Chemraz ® 639 is developed from an advanced polymer using fluoro-polymer nano-composite technology particles. Recommended for both static and dynamic dry wafer processing applications such as etch, remote plasma cleans, and deposition (CVD, HDPCVD), Chemraz® 639 remains stable at service temperatures up to 500°F (260°C).

With its broad chemical resistance, Chemraz ® 555, a perfluoroelastomer, is ideally suited for challenging fluid handling applications. Chemraz ® 555 provides a significantly wider operational band and superior compression set resistance than any other broad range perfluoroelastomer on the market. With an upper temperature limit of 600°F (316°C), Chemraz ® 555 is the elastomer of choice for the most demanding services found in the chemical process and refining industries and semiconductor SubFabs. Chemraz ® 555 is suitable for use in a wide variety of media, including acids, caustics, aldehydes, esters, ethers, aromatics, hot water, steam, amines, methanol, ketones, TBA, MTBE, and mixed process streams. Chemraz ® 555 is one of Greene Tweed’s many cost-effective products and services that extend the reliability and life of our customers’ equipment in hostile conditions while protecting the public and the environment from unwanted emissions. Chemraz ® 555 is available in o-rings, gaskets, and many other custom shapes.

Chemraz ® 656 is a low durometer perfluoroelastomer primarily designed for bonded slit valve gates and special engineered applications such as low sealing forces/tolerance stackups where softer materials aid in the total seal solution. Developed from an advanced polymer using fluoropolymer nano-composite technology particles, Chemraz ® 656 has very low metallic ion levels and offers unsurpassed resistance to today’s advanced process chemistries. Chemraz ® 656 is recommended for use in CVD, etch, and diffusion equipment applications.

Specifically developed to meet the demands of aggressive dry plasma systems, Chemraz ® 657 perfluoroelastomer’s unique formulation provides enhanced plasma resistance and minimal contamination, resulting in less downtime and higher wafer processing yields. Recommended primarily for both static and dynamic oxide etch wafer processing applications, Chemraz ® 657 remains stable at service temperatures up to 536°F (280°C) with excursions to 572°F (300°C).

Chemraz ® 663, a perfluoroelastomer (FFKM), is engineered to withstand low-temperature Etch and Deposition applications where plasma resistance and the ability to maintain sealing force in a vacuum are critical, such as electrostatic chuck assemblies.

Chemraz ® E38 is specifically developed for high-density plasma systems and diffusion processes where seal reliability and minimal contamination are essential. It provides excellent chemical compatibility and withstands a variety of aggressive chemicals. Available in a range of geometries and cross-sections, Chemraz ® E38 offers the diversity required for dynamic or static dry processing applications. Recommended for slit valves, Chemraz ® E38 remains stable at service temperatures as high as 500°F (260°C) where high sealing loads are not used.

Chemraz ® SD517 is a white, high-purity, synthetic, fluorinated rubber with comparable chemical compatibility to polytetrafluoroethylene (PTFE). Chemraz ® SD517 is a choice material for high-performance seals and custom flexible shapes in pharma, biotech, and food applications with comprehensive compliance. In applications where EPDM, silicone, or FKM seals are unsuitable or require multiple replacement each year, Chemraz ® SD517 can dramatically improve process reliability and safety.

Chemraz ® SD625 is a black, synthetic, high-purity rubber with temperature and chemical compatibility similar to PTFE. Chemraz ® SD625 parts have high service temperatures (up to 500°F/260°C), near-universal chemical compatibility, and extensive compliance coverage. Chemraz ® SD625 is our best-performing seal material for pharma, biotech, cosmetic, and food processing applications. Chemraz ® SD625 seals have exceptional service lifetimes in steam-in-place (SIP) applications relative to FKM, silicone, and EPDM seals. Chemraz ® SD625 o-rings and gaskets typically maintain sealing after thousands of steam sterilization cycles, orders of magnitude longer than other materials.

Chemraz ® XCD, a perfluoroelastomer, is specifically designed to exceed the most rigorous demands of front-end semiconductor thermal processing equipment. Chemraz ® XCD withstands the extreme thermal challenges typically found in LPCVD (low pressure chemical vapor deposition), RTP (rapid thermal process), and epitaxial deposition systems. Because of its unique polymer and filler structure, Chemraz ® XCD provides the lowest compression set at high operating temperatures (> 572°F/300°C) of any perfluoroelastomer on the market, resulting in increased seal integrity and longer seal lifetimes. This means reduced downtime and higher wafer processing yields. With the lowest outgassing profile for perfluoroelastomer materials in high-temperature applications, Chemraz ® XCD provides a cleaner process environment. Because of its reduced surface stiction, Chemraz ® XCD can be used for semi-dynamic and static sealing applications. Chemraz ® XCD remains stable at operating temperatures up to 572°F (300°C) while maintaining exceptional compression set.

Protection against oxygen-infused plasma is key in many etch chamber environments. These harsh environments often break down non-resistant materials, causing harmful particulation and, ultimately, defective chips. Greene Tweed’s Chemraz ® XPE is highly resistant to O2 plasma and can be used in a wide range of applications, such as slit valve doors, reaction chamber lid seals, and gate valve seals. This advanced elastomeric material offers the semiconductor and solar industry an alternative to legacy products that quickly erode in the oxygen environment. With excellent resistance to both O2 and CF4 plasmas, this material affords an increased chip yield and maximized production. In addition, XPE seals provide customers with an increased MTBR (mean time between repair) to reduce downtime and maintenance costs.

Chemraz ® XRZ, a perfluoroelastomer, is specifically developed to exceed the most rigorous demands of aggressive in situ NF3 plasma cleaning. Chemraz ® XRZ withstands the application challenges typically found in HDPCVD (high-density plasma chemical vapor deposition), PECVD (plasma enhanced CVD), and newer PEALD (plasma-enhanced atomic layer deposition) process chambers. Because of its unique molecular composite structure, Chemraz ® XRZ provides the highest plasma resistance available to fluorine plasma processes, resulting in minimal contamination. This leads to increased seal integrity and longer seal lifetimes, reducing downtime and driving higher wafer processing yields. Chemraz ® XRZ can be used for both static and semi- dynamic dry wafer processing applications such as etch, deposition (CVD, HDPCVD, PEALD), and remote plasma cleans. Chemraz ® XRZ remains stable at operating temperatures up to 572°F (300°C) while maintaining exceptional compression set.

Chemraz ® XTR, a perfluoroelastomer, is specifically designed to withstand the highly corrosive environments that commonly occur from using ClF3 as a cleaning gas. Chemraz ® XTR addresses application challenges typically found in ALD (atomic layer deposition) of titanium nitride and other nitride-based film deposition. With its unique molecular composition combined with fillers, it provides the highest available chemical resistance to thermal cleaning processes using ClF3, resulting in minimal contamination, minimal weight loss, and longer seal lifetime. This means less downtime and higher wafer-processing yields. Chemraz ® XTR is recommended for both static and semi- dynamic applications in systems used for film deposition and etching, specifically for ALD of new barrier layers for advanced devices. These layers consist of materials that are difficult to etch; therefore, ClF3 is employed for cleaning. Chemraz ® XTR has high chemical resistance to corrosive fluorine-based chemistries at elevated temperatures. In addition, Chemraz ® XTR remains stable to service temperatures exceeding 572°F (300°C) while demonstrating exceptional compression set resistance. This combination of excellent chemical resistance and low compression set in the extremely elevated temperatures found in process chambers extends seal longevity.

Fusion TM 706 is a low-durometer, high-purity fluoroelastomer, developed for a wide range of semiconductor processing sealing applications. Special engineering applications requiring low sealing force materials, such as bonded slit valve gates, are well suited for Fusion TM 706. Recommended for use in a range of plasma equipment applications, from etch and plasma enhanced CVD to plasma ashing applications, Fusion TM 706 is ideal for sealing devices that must accommodate tolerance stack-up conditions. Fusion TM 706 offers very low-metallic ion levels and good resistance to today’s advanced process chemistries. Contact Greene Tweed’s Semiconductor engineering and sales experts for specific application recommendations.

Specifically developed for flat panel display CVD and dry plasma etch equipment where seal reliability and minimal contamination are essential, Fusion ® 707 fluoroelastomer provides excellent chemical compatibility and withstands a variety of aggressive chemicals. Available in an infinite range of geometries and cross-sections, it offers the diversity required for a variety of dynamic or static dry processing applications. Fusion ® 707 remains stable at service temperatures up to 428°F (220°C) and is ideally suited for large lid seals and bonded slit valve door seals.

Fusion TM 742 performs well in aggressive chemicals and where ultrapure materials are not required. Recommended for conventional wet and dry system applications, Fusion TM 742 has a good field performance history in both dynamic and static applications. Its mid-range durometer allows the seal to conform to a wide range of hardware features.

WR ® 650 is a next-generation PFA composite reinforced with a three-dimensional carbon-fiber architecture. This material offers superior dry run capability, excellent wear and chemical resistance, and an operating temperature range up to 500°F (260°C). The advanced mechanical, thermal, and tribological properties of WR ® 650 provide increased operating efficiency and improved MTBR (mean time between repair). WR ® 650’s non-galling/non-seizing characteristics, and its ability to dampen vibrations, allow for tighter clearances compared to traditional metallic components, and increased efficiency. The malleable nature of PFA ensures metallic counter- parts are preserved, even those that are relatively soft (SS 304 or 316). This helps extend the service life of pumps and improves equipment reliability. WR ® 650 is available in a broad range of stock shapes, providing customers the ability to machine parts to their exact specifications.