LNP THERMOCOMP 9X99089 compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.

LNP THERMOCOMP EC004APQ compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive, FAR25.853 Compliant.

LNP THERMOCOMP EC004XXC compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.

LNP THERMOCOMP EC005 compound is based on Polyetherimide (PEI) resin containing 25% carbon fiber. Added features of this grade include: Electrically Conductive.

LNP THERMOCOMP EC005 compound is based on Polyetherimide (PEI) resin containing 25% carbon fiber. Added features of this grade include: Electrically Conductive.

LNP THERMOCOMP EC005 compound is based on Polyetherimide (PEI) resin containing 25% carbon fiber. Added features of this grade include: Electrically Conductive.

LNP THERMOCOMP EC006 compound is based on Polyetherimide (PEI) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive.

LNP THERMOCOMP EC006 compound is based on Polyetherimide (PEI) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive.

LNP THERMOCOMP EC006 compound is based on Polyetherimide (PEI) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive.

LNP THERMOCOMP EC006APQ compound is based on Polyetherimide (PEI) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive, High Flow, FAR25.853 Compliant.

LNP THERMOCOMP EC006AQW compound is based on Polyetherimide (PEI) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive. This grade has been pre-assessed and passed the material related tests from the ISO 10993 “Biological Evaluation of Medical Devices”.

LNP THERMOCOMP EC006E compound is based on Polyetherimide (PEI) resin containing 30% carbon fiber. Added features of this grade include: Easy Molding, Electrically Conductive.

LNP THERMOCOMP EC006PXQ compound is based on Polyetherimide (PEI) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive, Exceptional Processing, FAR25.853 Compliant.

LNP THERMOCOMP EC008 compound is based on Polyetherimide (PEI) resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive.

LNP THERMOCOMP EC008APQ compound is based on Polyetherimide (PEI) resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive, High Flow. FAR25.853 Compliant.

LNP THERMOCOMP EC008PXQ compound is based on Polyetherimide (PEI) resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive, Exceptional Processing, FAR25.853 Compliant.

LNP THERMOCOMP ECF62 compound is based on Polyetherimide (PEI) resin containing 30% glass fiber, 10% carbon fiber. Added features of this grade include: Electrically Conductive.

LNP THERMOCOMP EF002EXH compound is based on Polyetherimide (PEI) resin containing 10% glass fiber. Added features of this grade include: Healthcare.

LNP THERMOCOMP EF004 compound is based on Polyetherimide (PEI) resin containing 20% glass fiber.

LNP THERMOCOMP EF004XXP compound is based on Polyetherimide (PEI) resin containing 20% glass fiber. Added features of this grade include: High Modulus, High Strength, Good Dimension Stability and Good Warpage Control.

LNP THERMOCOMP EF006 compound is based on Polyetherimide (PEI) resin containing 30% glass fiber.

LNP THERMOCOMP EF006 compound is based on Polyetherimide (PEI) resin containing 30% glass fiber.

LNP THERMOCOMP EF006ER compound is based on Polyetherimide (PEI) resin containing 30% glass fiber. Added features of this grade include: Easy Molding, Mold Release.

LNP THERMOCOMP EF006H compound is based on Polyetherimide (PEI) resin containing 30% glass fiber. Added features of this grade include: Healthcare.

LNP THERMOCOMP EFB26ER compound is based on Polyetherimide (PEI) resin containing 30% glass fiber, 10% glass bead. Added features of this grade include: Easy Molding, Mold Release.

LNP THERMOCOMP EX00781H is a compound is based on Polyetherimide (PEI) resin containing 20% glass fiber. Added features of this grade include: Healthcare.

LNP THERMOCOMP EX00781H is a compound is based on Polyetherimide (PEI) resin containing 20% glass fiber. Added features of this grade include: Healthcare.

LNP THERMOCOMP EX00781H is a compound is based on Polyetherimide (PEI) resin containing 20% glass fiber. Added features of this grade include: Healthcare.

LNP THERMOCOMP EX06430H compound is based on Polyetherimide (PEI) resin containing mineral. Added features of this grade include: Healthcare, X-Ray Detectable.

LNP THERMOCOMP EX11414 compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive, FAR25.853 Compliant.

LNP THERMOCOMP EX93452 compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.

LNP THERMOCOMP EX93452 compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.

LNP THERMOCOMP PDXE00715EES compound is based on Polyetherimide (PEI) resin containing 10% glass fiber. Added features of this grade include: Healthcare.

LNP THERMOCOMP PDXE98480 compound is based on Polyetherimide (PEI) resin containing 40% glass fiber.