Nemcon™ H PO DP117/X2
NemconTM H-series products are designed for use in applications where heat removal is critical to system performance. NemconTM H PO DPll7/X2 is a thermally conductive polyolefin, available as an injection moldable grade to replace metals in enclosures and medical device parts. It should be used in applications where thermal management must be accomplished along with aesthetics and cost-effectiveness.
一般属性
使用 Prospector 建立免費帳戶時，可造訪 Nemcon™ H PO DP117/X2 的完整資料表詳細資訊。您將找到有關物理、機械和硬度規格的完整資訊
物料形态
已商用：当前有效
文档
可用性
北美洲
用途
金属取代
加工方式
注射成型
其他属性
特性, 形式, 密度 / 比重, 拉伸模量, 拉伸断裂强度, 断裂伸长率, 弯曲模量, 弯曲断裂强度, 悬壁梁缺口冲击强度, DTUL (264 psi) - 未退火, 导热系数, 表面电阻率
加工
Find specific processing information for Nemcon™ H Thermally Conductive Compounds as well as general information for the 非特指聚烯烃（非特指聚烯烃） generic family. 注册 或 登录 了解更多信息。
