Nemcon™ H ES DP110/X3
Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H ES DP110/X3 is a thermally conductive polycarbonate alloy, combining good thermal conductivity with improved HDT and processability relative to conventional polycarbonate compounds.
Typical Applications
Typical Applications
- Housings for power components.
- Encapsulation/housings for bobbins, actuators, and coils.
- IC thermal management components, such as heat sinks, heat spreaders, or heat pipes.
- LED lighting assemblies.
一般属性
使用 Prospector 建立免費帳戶時，可造訪 Nemcon™ H ES DP110/X3 的完整資料表詳細資訊。您將找到有關物理、機械和硬度規格的完整資訊
物料形态
Comercial: Ativo
文档
可用性
América do Norte
用途
Aplicações Elétricas/Eletrônicas
其他属性
Características, Formas, Densidade / Gravidade específica, Módulo de Tensão, Tensão na ruptura, Alongamento na Ruptura, Módulo de Flexão, Flexural Strength at Break, Impacto Izod com entalhe, DTUL (264 psi) - não recozido, Condutividade térmica, Resistividade superficial
加工
Find specific processing information for Nemcon™ H Thermally Conductive Compounds as well as general information for the Polycarbonate Alloy generic family. 注册 或 登录 了解更多信息。
