Nemcon™ H ABS DP116P
Typical Applications
- Encapsulations/housings for power components.
- Encapsulation of passive components.
- IC thermal management components, such as heat sinks, heat spreaders, or heat pipes.
- LED lighting assemblies.
一般属性
使用 Prospector 建立免費帳戶時,可造訪 Nemcon™ H ABS DP116P 的完整資料表詳細資訊。您將找到有關物理、機械和硬度規格的完整資訊
加工
Find specific processing information for Nemcon™ H Thermally Conductive Compounds as well as general information for the 丙烯腈丁二烯苯乙烯 generic family. 注册 或 登录 了解更多信息。