Commercial: Active

Africa & Middle East, Asia Pacific, Europe, Latin America, North America

Also Available In, Density / Specific Gravity, Density, Apparent (Bulk) Density, Melt Mass-Flow Rate (MFR), Melt Mass-Flow Rate (MFR), Melt Volume-Flow Rate (MVR), Spiral Flow, Mold Shrink, Linear-Flow, Molding Shrinkage, Water Absorption @ 24 hrs, Water Absorption 24h/23C, Water Absorption Sat/23C, Water Absorption @ Equil, Water Absorption 23C/50RH, Tensile Modulus, Tensile Modulus, Tensile Strength, Tensile Strength at Yield, Tensile Stress at Yield, Tensile Strength at Break, Tensile Stress at Break, Tensile Stress, Tensile Elongation at Yield, Tensile Strain at Yield, Tensile Elongation at Break, Tensile Strain at Break, Nominal Tensile Strain at Break, Flexural Modulus, Flexural Modulus, Flexural Strength, Flexural Stress, Flexural Strength at Yield, Flexural Strength at Break, Compressive Stress, Charpy Notched Impact Strength, Charpy Unnotched Impact Strength, Notched Izod Impact, Notched Izod Impact Strength, Unnotched Izod Impact, Gardner Impact, Gardner Impact, Rockwell Hardness, Rockwell Hardness, Ball Indentation Hardness, DTUL (66 psi) - Unannealed, DTUL (0.45 MPa) Unannealed, DTUL (66 psi) - Annealed, DTUL (0.45 MPa) Annealed, DTUL (264 psi) - Unannealed, DTUL (1.80 MPa) Unannealed, DTUL (264 psi) - Annealed, DTUL (1.80 MPa) Annealed, Glass Transition Temperature, Glass Transition Temperature, Vicat Softening Temperature, Vicat Softening Temperature, CLTE, Flow, CLTE, Flow (TMA), Coefficient of Linear Thermal Expansion, Flow, Specific Heat, Thermal Conductivity, Thermal Conductivity, Surface Resistivity, Surface Resistivity, Volume Resistivity, Volume Resistivity, Dielectric Strength, Electric Strength, Dielectric Constant, Dielectric Constant, Dissipation Factor, Dissipation Factor, Insulation Resistance, Burning Rate, Glow Wire Flammability Index, Glow Wire Ignition Temperature, Refractive Index, Refractive Index, Light Transmittance, Haze, Yellowness Index, Drying Temperature, Drying Time, Suggested Max Moisture, Suggested Max Regrind, Hopper Temperature, Rear Temperature, Middle Temperature, Front Temperature, Nozzle Temperature, Processing (Melt) Temp, Mold Temperature, Injection Pressure, Back Pressure, Screw Speed, Injection Notes, Drying Temperature, Drying Time, Melt Temperature, Die Temperature, Extrusion Notes