CONAP® CE-1170
CONAP CE-1170 is a solvent-based coating designed for thin-film applications on components and printed circuitry. It was developed specifically for its fast drying time and reparability, as well as to provide the u ltimate in humidity resistance and hydrolytic stability while retaining excellent flexibility to prevent fracturing of fragile components during thermal cycling. Its electrical properties are outstanding.
Cured films maintain excellent adhesion to phenolic and epoxy-glass laminates even in adverse environmental conditions. Components may be removed by heating the coating with a soldering iron, or the entire coating may be removed with a suitable solvent. A tracer dye has been incorporated to aid inspection under ultraviolet light.
一般属性
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Technical Datasheet (English)
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