CONAP® CE-1171
CONAP CE-1171 is designed for thin-film applications on components and printed circuitry. It was developed specifically for its fast drying time and reparability and to provide the ultimate in humidity resistance and hydrolytic stability. CONAP CE-1171 retains excellent flexibility to prevent fracturing of fragile components during thermal cycling. Electrical properties are outstanding.
Cured films maintain excellent adhesion to phenolic and epoxy glass laminates even in adverse environmental conditions. Components may be removed by melting through the coating with a soldering iron, or the entire coating may be removed with a suitable solvent. A tracer dye has been incorporated to aid inspection under ultra-violet light.
一般属性
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Technical Datasheet (English)
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