SI-LINK™ DFDB-5400 NT
UV resistance allowing the wire to be printed "SunRes" may be achieved with the addition of a UV stabilizer package. The formulation for such an additive is available upon request and the resulting product is bulletinized by UL as DFDB-5425 UV. For accelerated curing applications SI-LINK™ DFDB-5400 NT can be used in conjunction with SI-LINK™ AC DFDB-5451 NT Polyethylene and the catalyst masterbatch SI-LINK™ AC DFDA-5488 NT Polyethylene to form a flame retardant SI-LINK™ AC polyethylene insulation system. This system is recognized by UL as DFDB-5425 AC. It is formulated to pass the UL-44 horizontal burn test on 14 AWG (1.63 mm) wire, 0.030" wall thickness, at a 25% loading with 70% SI-LINK™ DFDB-5451 NT and 5% SI-LINK™ AC DFDA-5488 NT.
SPECIFICATIONS
The DFDB-5425 systems are bulletinized by UL for XHH, XHHW, XHHW-2, RHH, RHW, RHW-2, SIS, USE and USE-2. They are also suitable for CSA RW-90, and RWU-90 applications.
一般属性
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加工
Find specific processing information for SI-LINK™ Moisture-curable Compounds as well as general information for the 聚乙烯,未指定 generic family. 注册 或 登录 了解更多信息。