Borlink™ LE0500
Applications
Borlink LE0500 is intended for semiconductive shielding of XLPE extra high voltage (EHV) cables.
Specifications
Borlink LE0500 meets the applicable requirements as below when processed using sound extrusion practices and testing procedures
- AEIC CS8
- AEIC CS9
- BS 6622
- Cenelec HD 620 S1
- Cenelec HD 632 S1
- DIN VDE 0276-620
- DIN VDE 0276-632
- ICEA S-108-720
- ICEA S-93-639
- ICEA S-94-649
- ICEA S-97-682
- IEC 60502-2
- IEC 60840
- IEC 62067
- NF C33-223
- NF C33-226
- UTE C 33-223
Special Features
Borlink LE0500 is a ready-to-use Supersmooth semiconductive compound. It offers excellent thermal stability which provides robust cable extrusion and crosslinking at high surface temperature.
The excellent distribution of carbon black and additives in Borlink LE0500 results in a superior smoothness of the semiconductive screen.
一般属性
使用 Prospector 建立免費帳戶時,可造訪 Borlink™ LE0500 的完整資料表詳細資訊。您將找到有關物理、機械和硬度規格的完整資訊
Technical Datasheet (English)
下载文档加工
Find specific processing information for Borlink™ Crosslinkable Compound as well as general information for the 聚乙烯,未指定 generic family. 注册 或 登录 了解更多信息。