Perlast® G75H
High temperature perfluoroelastomer for Semiconductor applications
Perlast® G75H incorporates a novel reinforcement system which produces a synthetically clean compound formulated for minimum particle generation combined with excellent resistance to aggressive oxygen and fluorine based plasmas.
Specially developed for Plasma and Gas Deposition applications including ashing, etching, HDPCVD, PECVD, SACVD.
Particularly suited for use in applications which require exposure to temperatures of up to 320°C (608°F) combined with excellent mechanical properties.
Key Attributes
Typical Applications
Perlast® G75H incorporates a novel reinforcement system which produces a synthetically clean compound formulated for minimum particle generation combined with excellent resistance to aggressive oxygen and fluorine based plasmas.
Specially developed for Plasma and Gas Deposition applications including ashing, etching, HDPCVD, PECVD, SACVD.
Particularly suited for use in applications which require exposure to temperatures of up to 320°C (608°F) combined with excellent mechanical properties.
Key Attributes
- Excellent plasma resistance
- High temperature stability
- Wide chemical resistance
- Low out-gassing properties making it ideal for vacuum applications
- Ultra low metal ion content
- Low coefficient of thermal expansion
- Outstanding physical properties make G75H ideal for dynamic applications.
Typical Applications
- Dynamic seals
- Static seals
- Other components
一般属性
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物料形态
已商用：当前有效
文档
description
Technical Datasheet (English)
下载文档可用性
北美洲, 欧洲, 亚太地区
用途
电气/电子应用领域
其他属性
特性, 外观, 拉伸应力（在100％时）, 拉伸应力（在100％时）, 拉伸屈服强度, 拉伸屈服应力, 断裂伸长率, 拉伸断裂应变, 压缩永久变形, 压缩永久变形, 肖氏硬度, IRHD 硬度, IRHD 硬度, 其他性能, 补充信息
加工
Find specific processing information for Perlast® Perfluoroelastomer as well as general information for the 全氟化橡胶 (PFE) generic family. 注册 或 登录 了解更多信息。
