Kimura® K13X
A dark brown high performance polymer containing a unique self- reinforcing polymer structure, developed specifically for critical semiconductor applications. The high purity of the polymer combined with the absence of any fillers makes this polymer suitable for processes involving lower feature sizes. This material has a low coefficient of thermal expansion, low compression set and has an extremely low etch rate in aggressive plasma environments.
Key Attributes
Typical Applications
Key Attributes
- Exceptionally pure - does not contain any fillers which may cause particulation problems.
- Outstanding plasma resistance - ideal for Chlorine, Fluorine & Oxygen chemistries.
- Exceptionally low plasma etch rate
- Low thermal expansion
- Retro-fits existing O-ring grooves (including FKM & FFKM grooves)
- Low permeation
- Low out-gassing
- Low adhesion (reduced sticking)
- Low friction, high strength and high modulus make K13X ideal for constant force dynamic applications.
Typical Applications
- Dynamic seals
- Static seals
- Wafer-handling products
一般属性
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物料形态
已商用：当前有效
文档
description
Technical Datasheet (English)
下载文档可用性
北美洲, 欧洲, 亚太地区
用途
电气/电子应用领域
其他属性
特性, 外观, 拉伸应力（在100％时）, 拉伸应力（在100％时）, 拉伸屈服强度, 拉伸屈服应力, 断裂伸长率, 拉伸断裂应变, 压缩永久变形, 压缩永久变形, 肖氏硬度, 肖氏硬度, IRHD 硬度, IRHD 硬度, 其他性能, 补充信息
加工
Find specific processing information for Kimura® as well as general information for the Elastomer, Specialty generic family. 注册 或 登录 了解更多信息。
