Kimura® K2CD
Key Attributes
- Exceptionally pure - does not contain any fillers which may cause particulation problems.
- Outstanding plasma resistance - ideal for Chlorine, Fluorine & Oxygen chemistries.
- Exceptionally low plasma etch rate
- Low thermal expansion
- Retro-fits existing O-ring grooves (including FKM & FFKM grooves)
- Low permeation
- Low out-gassing
- Low adhesion (reduced sticking)
Typical Applications
- Dynamic seals
- Static seals
- Wafer-handling products
一般属性
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Technical Datasheet (English)
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