KYOCERA KE-1150
Strong Points
- Less Warpage in All Types of Area Array Packages due to High Tg Characteristic.
- Applicable to Fine Pitch Wire Bonding with Good Wire Sweep Performance.
- Achieve High Yield after Molding due to Excellent Moldability that allows its application to MAP.
Application
- Standard P-BGA, HS-BGA and LGA Package.
- Multi Chip Module (Stacked or Side by Side Layout)
- IC Card, Memory Card etc.
Low Alpha Ray Type: KE-2150
一般属性
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Technical Datasheet (English)
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