KYOCERA KE-300K
Strong Points
- Achieve Good and Necessary Filling in KE-520Series to Apply to Ultra Small Packages.
- JEDEC level 1 is Possible in Ultra Small Packages.
- Good Adhesion Strength Even after High Temperature Reflow Soldering Process.
- Fast Cure Enabling High Productive In-Line Auto Process.
- Excellent moldability and show improvement in moldability yield.
Application
- Surface Mount Device
- TO-92 Type (Insertion Type)
- Ultrasmall PKG
一般属性
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Technical Datasheet (English)
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