KYOCERA KE-300TS-1
Strong Points
- Provide Various Molding Compounds with High Reliability to Cover Many Applications such as LSI, Transistors and Diodes.
- Good Curability and Applicable to Various Molding Machines (Both Automated and Conventional)
- Low Stress of Large chips and Applicable to Encapsulation.
Application
Smaller SOP, Smaller QFP, DIP, SIP/ZIP, TO-PKG, DPAK, SOT, Unbalanced PKG, Module
一般属性
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Technical Datasheet (English)
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