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KYOCERA KE-850SP

通用系列: Epoxy; Epoxide提供方: KYOCERA Chemical Corporation
Developed for Power Device Package that needs Good Heat Dissipation Through Molding Compound.

Strong Points
  • High Thermal Conductivity with Good Moldability, Excellent Moisture Resistance and Low Stress.
  • Used in Auto Molding System by Rapid Cure Grades.
  • KE-870 and KE-880 is Formulated with Special High Thermal Conductivity Filler System and Achieve High Thermal Conductivity (above 3W/m K).

Application
  • Isolation Packages such as TO-220 and TO-3P that need Heat Dissipation Characteristics.
  • Packages for High Heating Volume such as Power Module.
一般属性

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物料形态
Commercial: Active
文档
description

Technical Datasheet (English)

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可用性
Asia Pacific
用途
Electrical/Electronic Applications
其他属性
Features, Density / Specific Gravity, Spiral Flow, Glass Transition Temperature, CLTE, Flow, Thermal Conductivity, Gel Time
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加工

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