Epoxies, Ect. 20-3035 (Cat.190)
20-3035 is a low density, two component epoxy potting and encapsulating system. The 20-3035 is less than half the weight of most commercially available potting compounds.
20-3035 exhibits very low shrinkage during the cure cycle and also has a low coefficient of thermal expansion. This unique epoxy system is an ideal material for the potting of electronic assemblies where a low dielectric constant and low weight are required.
This epoxy syntactic foam system utilizes an advanced micro balloon technology filler. The 20-3035 provides high strength and stiffness, thermal and environmental stability, creep resistance, and water resistance.
Features:
- Low Dielectric Constant
- Low Coefficient of Thermal Expansion
- Low Shrinkage
- Low Density
- Excellent Moisture Resistance
20-3035 exhibits very low shrinkage during the cure cycle and also has a low coefficient of thermal expansion. This unique epoxy system is an ideal material for the potting of electronic assemblies where a low dielectric constant and low weight are required.
This epoxy syntactic foam system utilizes an advanced micro balloon technology filler. The 20-3035 provides high strength and stiffness, thermal and environmental stability, creep resistance, and water resistance.
Features:
- Low Dielectric Constant
- Low Coefficient of Thermal Expansion
- Low Shrinkage
- Low Density
- Excellent Moisture Resistance
一般属性
使用 Prospector 建立免費帳戶時，可造訪 Epoxies, Ect. 20-3035 (Cat.190) 的完整資料表詳細資訊。您將找到有關物理、機械和硬度規格的完整資訊
物料形态
已商用：当前有效
文档
description
Technical Datasheet (English)
下载文档可用性
北美洲, 非洲和中东, 拉丁美洲, 欧洲, 亚太地区
用途
电气/电子应用领域
加工方式
包封
其他属性
特性, 流动方向收缩, 弯曲强度, CLTE，流动, 导热系数, 热固性混合粘度, 其他性能, Mix Ratio by Weight (PBW), 密度, 粘度, 固化时间, 储存稳定性, 吸水率, 支撐硬度, 抗张强度, 压缩强度, 耐电强度, 相对电容率, 体积电阻率, 耗散因数
加工
Find specific processing information for Epoxies, Ect. as well as general information for the 环氧; 环氧树脂 generic family. 注册 或 登录 了解更多信息。
购买地点
您可以從 1 個經銷商或製造商處購買 Epoxies, Ect. 20-3035 (Cat.190)。 注册 或 登录 了解更多信息。
