Epoxies, Ect. 20-1650
20-1650 can be used for potting or encapsulating electronic packages that have sensitive components. Due to its low stress during and after cure, this material will not crush or damage delicate components.
20-1650 is formulated without solvents or other toxic materials. It is therefore not regulated or considered hazardous for transportation.
Features:
- High operating temperatures
- Easy 1:1 mix ratio
- Low Viscosity
- Flexible
- Deep section curing (beyond 1-2 inches)
- Solvent free
Benefits:
- Good protection in extreme environmental applications
- Simple to use
- Dispenses and pours easily without air bubbles
- Low stress on components and vibration resistant
- No need for multiple pours due to low exotherm
- No by-products released during cure and safe to handle
一般属性
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Technical Datasheet (English)
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