50-3170 is a high performance, thermally conductive epoxy rubber formulation designed for those applications requiring excellent electrical insulation and low stress during cure.

50-3170 can be used for bonding sensitive components or for potting of power supplies, coils, glass diodes, and other delicate assemblies. This new formulation can be used successfully for transformers, regulators, PCB's, etc...

50-3170 is an ideal resin system for encapsulation of electronic packages with low stress requirements. The resin has a rubber consistency and retains its properties and flexibility on long term aging. This allows pottings and castings to be probed for detection of electrical failure.

50-3170 is a repairable system. After defective components have been located, the probe path can be totally sealed by applying fresh resin with a hypodermic syringe. 50-3170 will bond to itself forming a totally sealed system.