Miramid® VE25CW
一般属性
使用 Prospector 建立免費帳戶時，可造訪 Miramid® VE25CW 的完整資料表詳細資訊。您將找到有關物理、機械和硬度規格的完整資訊
物料形态
已商用：当前有效
文档
可用性
欧洲
用途
电气/电子应用领域
加工方式
注射成型
多点数据
- Isothermal Stress vs. Strain (ISO 11403)
- Secant Modulus vs. Strain (ISO 11403)
- Shear Modulus vs. Temperature (ISO 11403)
其他属性
Filler / Reinforcement, Additive, Features, Forms, Density, Water absorption, Humidity absorption, Viscosity number, Tensile modulus, Stress at break, Strain at break, Tensile Creep Modulus 1000h, Flexural Stress, Charpy notched impact strength (+23°C), Charpy notched impact strength (-30°C), Charpy impact strength (+23°C), Charpy impact strength (-30°C), Temp. of deflection under load (0.45 MPa), Temp. of deflection under load (1.80 MPa), Melting Temperature (DSC), Volume resistivity, Dielectric Constant, Dissipation factor (1 MHz), Comparative tracking index, Processing (Melt) Temp, Mold Temperature
加工
Find specific processing information for Miramid® Polyamide as well as general information for the Polyamide 6 generic family. 注册 或 登录 了解更多信息。
