WEVOPUR 923 M/WEVONAT 507
Two-component encapsulating system based on polyurethane. The resin component is formulated with a nonabrasive mineral filler.
The cured polymer exhibits tough-elastic properties as well as outstanding adhesion to most plastic materials, metals and glass and excellent behavior in thermal cycle tests.
Temperature range of use: -40°C to +120°C.
The product can be used at higher temperatures on a short term basis.
The casting resin is used with WEVONAT 507
Applications: Encapsulation of electrical components for low and medium voltage applications like sensors, switches or PCBs.
The cured polymer exhibits tough-elastic properties as well as outstanding adhesion to most plastic materials, metals and glass and excellent behavior in thermal cycle tests.
Temperature range of use: -40°C to +120°C.
The product can be used at higher temperatures on a short term basis.
The casting resin is used with WEVONAT 507
Applications: Encapsulation of electrical components for low and medium voltage applications like sensors, switches or PCBs.
一般属性
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物料形态
已商用：当前有效
文档
description
Technical Datasheet (English)
下载文档可用性
北美洲, 欧洲
用途
Encapsulant
其他属性
填料/增强材料, 特性, RoHS 合规性, 外观, 密度, 拉伸应力, 拉伸断裂应变, 肖氏硬度, 玻璃转化温度, 线性热膨胀系数，流动, 导热系数, 表面电阻率, 体积电阻率, 介电强度, 介电常数, 耗散因数, 漏电起痕指数, UL 阻燃等级, 热固性混合粘度, 其他性能
加工
Find specific processing information for WEVOPUR as well as general information for the 聚氨酯，未指定 generic family. 注册 或 登录 了解更多信息。
购买地点
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