LiPOLY® T-top81
Ultra Soft & Highly Thermally Conductive Gap Filler
LiPOLY T-top81 is a high deflection gap pad,with outstanding thermal conductivity and low thermal resistance in formshape. T-top81 offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat. T-top81 was designed for thermal modules with limited gap sizes and low compression force.
Features-
Typical Applications-
LiPOLY T-top81 is a high deflection gap pad,with outstanding thermal conductivity and low thermal resistance in formshape. T-top81 offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat. T-top81 was designed for thermal modules with limited gap sizes and low compression force.
Features-
- Thermal conductivity: 8.0 W/m*K
- High compression rate
- Low thermal impedance
- Silicone compound
- UL 94V-0 qualified
Typical Applications-
- Between CPU and heat sink.
- Between a component and heat sink
- Flat-panel displays
- Power supplies
- High speed mass storage drives
- Telecommunication hardware
一般属性
使用 Prospector 建立免費帳戶時，可造訪 LiPOLY® T-top81 的完整資料表詳細資訊。您將找到有關物理、機械和硬度規格的完整資訊
物料形态
已商用：当前有效
文档
可用性
北美洲, 非洲和中东, 拉丁美洲, 欧洲, 亚太地区
其他属性
特性, 外观, 密度 / 比重, 肖氏硬度, 导热系数, 表面电阻率, 体积电阻率, 介电强度, UL 阻燃等级
加工
Find specific processing information for LiPOLY® as well as general information for the 硅酮 (Silicone) generic family. 注册 或 登录 了解更多信息。
