WEVOPUR 308 W/WEVONAT 500
Two-component unfilled encapsulating system based on polyurethane.
The resin component is formulated with a low abrasive mineral filler.
The material is approved and listed under the File No. E108835 and achieves UL 94 HB properties at a thickness of 6,0 mm.
Temperature range of use: -30°C to +130°C.
The casting resin is used with WEVONAT 500
Applications: Encapsulation of electrical components for low and medium voltage applications.
The resin component is formulated with a low abrasive mineral filler.
The material is approved and listed under the File No. E108835 and achieves UL 94 HB properties at a thickness of 6,0 mm.
Temperature range of use: -30°C to +130°C.
The casting resin is used with WEVONAT 500
Applications: Encapsulation of electrical components for low and medium voltage applications.
一般属性
使用 Prospector 建立免費帳戶時，可造訪 WEVOPUR 308 W/WEVONAT 500 的完整資料表詳細資訊。您將找到有關物理、機械和硬度規格的完整資訊
物料形态
Comercial: Ativo
文档
可用性
América do Norte, Europa
用途
Encapsulant
其他属性
Carga/Reforço, Conformidade RoHS, Aparência, Densidade, Esforço de tensão, Deformação por tensão na ruptura, Dureza Shore, Temperatura de transição do vítrea (DSC), Coeficiente de expansão térmica linear, Fluxo, Condutividade térmica, Resistividade superficial, Resistividade volumétrica, Resistência eléctrica, Constante dieléctrica, Factor de dissipação, Índice comparativo de resistência à descarga superficial, Classificação da chama UL, Thermoset Mix Viscosity, Propriedades adicionais
加工
Find specific processing information for WEVOPUR as well as general information for the Polyurethane, Unspecified generic family. 注册 或 登录 了解更多信息。
购买地点
您可以從 1 個經銷商或製造商處購買 WEVOPUR 308 W/WEVONAT 500。 注册 或 登录 了解更多信息。
