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AvaSpire® AV-622

通用系列: 聚芳基甲酮提供方: Syensqo
AvaSpire® AV-622 is an unreinforced polyaryletherketone (PAEK) that offers improved ductility and impact strength relative to PEEK while retaining most of the key performance attributes of PEEK. The AV-622 grade is the low melt flow (higher molecular weight) resin that is suited for a variety of processing methods including compression molding, stock shape extrusion, as well as injection molding.

AV-622 has been formulated for applications requiring a balance of chemical resistance and mechanical strength along with good part aesthetics and high purity, thereby bridging the performance gaps within the ultra polymers space. These and other properties make this resin well-suited for applications in semiconductor, electronics, and other industries.

AvaSpire® AV-622 is easily fabricated using conventional thermoplastic melt processing techniques and standard equipment. The resin has a uniform opaque appearance with a beige color similar to that of PEEK.
  • AvaSpire® AV-622 NT
一般属性

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物料形态
已商用:当前有效
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description

Technical Datasheet

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可用性
北美洲, 非洲和中东, 拉丁美洲, 欧洲, 亚太地区
用途
半导体模制化合物
加工方式
薄膜挤出
其他属性
特性, RoHS 合规性, 外观, 形式, 密度 / 比重, 熔流率(熔体流动速率), 流动方向收缩, 垂直流动方向的收缩, 24小时吸水率, 拉伸模量, 拉伸模量, 抗张强度, 拉伸屈服应力, 屈服伸长率, 拉伸屈服应变, 断裂伸长率, 拉伸断裂应变, 弯曲模量, 弯曲模量, 弯曲强度, 弯曲应力, 压缩强度, 剪切强度, 泊松比, 悬壁梁缺口冲击强度, 悬壁梁缺口冲击强度, 无缺口悬臂梁冲击, 无缺口伊佐德冲击强度, 洛氏硬度, DTUL (264 psi) - 已退火, 玻璃转化温度, 熔融峰值温度, CLTE,流动 (TMA), 比热, 导热系数, 表面电阻率, 体积电阻率, 介电强度, 介电常数, 耗散因数, UL 阻燃等级, 极限氧指数, 熔体粘度, 干燥温度, 干燥时间, 料筒后部温度, 料筒中部温度, 料筒前部温度, 射嘴温度, 加工(熔体)温度, 模具温度, 注射速度, 螺杆压缩比
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加工

Find specific processing information for AvaSpire® PAEK as well as general information for the 聚芳基甲酮 generic family. 注册 登录 了解更多信息。

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