PolyCond XSC 10
SEMICONDUCTOR COMPOUND
The thermoset compound Polycond XSC 10 is a semiconductor, used as a conductor shield (internal) or insulation (external). It has additives for superior resistance to thermal oxidation, metal ion neutralizer and additives to allow high production speeds. The compound XSC10 contains in its composition additives to became strippable when used on power cables.
CROSS-LINKING
The highly reactive resin/catalyst system allows rapid cross-linking in a sauna with saturated steam (90°C) or heated water (up to 80°C).
The thermoset compound Polycond XSC 10 is a semiconductor, used as a conductor shield (internal) or insulation (external). It has additives for superior resistance to thermal oxidation, metal ion neutralizer and additives to allow high production speeds. The compound XSC10 contains in its composition additives to became strippable when used on power cables.
CROSS-LINKING
The highly reactive resin/catalyst system allows rapid cross-linking in a sauna with saturated steam (90°C) or heated water (up to 80°C).
一般属性
使用 Prospector 建立免費帳戶時，可造訪 PolyCond XSC 10 的完整資料表詳細資訊。您將找到有關物理、機械和硬度規格的完整資訊
物料形态
已商用：当前有效
文档
description
Technical Datasheet (English)
下载文档可用性
拉丁美洲
用途
半导体模制化合物
加工方式
电线&线缆挤出成型
其他属性
特性, 密度, 拉伸断裂应变, 体积电阻率, 料筒1区温度, 料筒2区温度, 料筒3区温度, 料筒4区温度, 料筒5区温度, 熔体温度
加工
Find specific processing information for PolyCond as well as general information for the 热固性，未指定 generic family. 注册 或 登录 了解更多信息。
