Dyna-Purge® K
"Dual Power" cleaning, designed specifically for low-temp resins
DYNA-PURGE K is a low-temperature, non-abrasive, non-chemical engineered thermoplastic purging compound, formulated to flow naturally through the machine. Two unique ingredients provide for "dual power" cleaning. A non-melting but softening thermoplastic scrubs while a proprietary agent expands, effectively removing contamination.
FEATURES & BENEFITS:
DYNA-PURGE K is a low-temperature, non-abrasive, non-chemical engineered thermoplastic purging compound, formulated to flow naturally through the machine. Two unique ingredients provide for "dual power" cleaning. A non-melting but softening thermoplastic scrubs while a proprietary agent expands, effectively removing contamination.
FEATURES & BENEFITS:
- Designed for color changes, resin changes, preventative machine maintenance, and prior to manual cleaning
- Safe for purging through equipment with a minimum clearance of .025 inch (.65 mm)
- Effective through a broad temperature range 290° F - 550° F (143° C - 287° C)
- Easy to use- no process adjustment, no mixing or soaking required
- Non-abrasive, non-melting but softening thermoplastic, thoroughly loosens carbonized and degraded resin, allowing it to be flushed away
- Safe, non-hazardous, ingredients are FDA compliant
- Heat stable- recommended during shutdown and start-up
- Economical- low "cost-per-purge"- only a small quantity needed to be effective
- Unlimited shelf life
一般属性
使用 Prospector 建立免費帳戶時，可造訪 Dyna-Purge® K 的完整資料表詳細資訊。您將找到有關物理、機械和硬度規格的完整資訊
物料形态
Commercial: Active
文档
description
Technical Datasheet (English)
下载文档可用性
North America
用途
Purging Compound
加工方式
Cast Film
其他属性
Agency Ratings, Forms, Additional Information
加工
Find specific processing information for Dyna-Purge® Purging Compounds as well as general information for the Proprietary generic family. 注册 或 登录 了解更多信息。
