Plaskon MUF-LFG
This material is an epoxy Molded UnderFill compound developed for transfer mold equipment to underfill, and overmold if needed, Flip Chip in Package (FC-BGA and FC-CSP) in one step. It offers high productivity with an automated, simple, robust and fast process compared to liquid encapsulation. Higher reliability is demonstrated with the material's higher Tg, lower CTE, no particle segregation or settling and longer outlife compared to liquid encapsulants. PLASKON? MUF is the total molded underfill solution for Flip Chip in Package.
一般属性
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物料形态
已商用：当前有效
可用性
北美洲
加工方式
树脂传递成型
其他属性
特性, 形式, 密度 / 比重, 弯曲模量, 弯曲强度, 玻璃转化温度, CLTE，流动, 导热系数, UL 阻燃等级, 补充信息, 注射说明
加工
Find specific processing information for Plaskon as well as general information for the 环氧; 环氧树脂 generic family. 注册 或 登录 了解更多信息。
