Nemcon™ H PC DP111/X1
Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H PC DP111/X1 is a thermally and electrically conductive polycarbonate compound, combining good thermal conductivity with ESD control, high HDT and good processability.
Typical Applications
Typical Applications
- ESD-safe housings for use in aggressive thermal environments.
- ESD assemblies for use in power assemblies.
- Board level ESD control components.
一般属性
使用 Prospector 建立免費帳戶時，可造訪 Nemcon™ H PC DP111/X1 的完整資料表詳細資訊。您將找到有關物理、機械和硬度規格的完整資訊
物料形态
已商用：当前有效
文档
可用性
北美洲
用途
电气/电子应用领域
其他属性
特性, 形式, 密度 / 比重, 拉伸模量, 拉伸断裂强度, 断裂伸长率, 弯曲模量, 弯曲断裂强度, 悬壁梁缺口冲击强度, DTUL (264 psi) - 未退火, 导热系数, 表面电阻率
加工
Find specific processing information for Nemcon™ H Thermally Conductive Compounds as well as general information for the 聚碳酸酯 generic family. 注册 或 登录 了解更多信息。
