含氟聚合物 (Fluoropolymer): LNP™ THERMOCOMP™ Compound
| 产品 | 可用性 | 产品说明 |
|---|---|---|
| LNP™ THERMOCOMP™ Compound 2C003 | アジア太平洋地域 |
LNP THERMOCOMP 2C003 compound is based on Ethylene Tetrafluoroethylene (ETFE) resin containing 15% carbon fiber. Added features of this grade include: Electrically Conductive.
|
| LNP™ THERMOCOMP™ Compound 2C004 | アジア太平洋地域 |
LNP THERMOCOMP 2C004 compound is based on Ethylene Tetrafluoroethylene (ETFE) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.
|
| LNP™ THERMOCOMP™ Compound 2F004 | アジア太平洋地域 |
LNP THERMOCOMP 2F004 compound is based on Ethylene Tetrafluoroethylene (ETFE) resin containing 20% glass fiber.
|
| LNP™ THERMOCOMP™ Compound 2F005 | アジア太平洋地域 |
LNP THERMOCOMP 2F005 compound is based on Ethylene Tetrafluoroethylene (ETFE) resin containing 25% glass fiber.
|
| LNP™ THERMOCOMP™ Compound 2X04505 | アジア太平洋地域 |
LNP THERMOCOMP 2X04505 compound is based on Ethylene Tetrafluoroethylene (ETFE) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.
|
| LNP™ THERMOCOMP™ Compound 2X95787 - Americas | ラテンアメリカ |
LNP THERMOCOMP 2X95787 compound is based on Ethylene Tetrafluoroethylene (ETFE) resin containing 15% glass fiber.
|
| LNP™ THERMOCOMP™ Compound 2X95787 - Asia | アジア太平洋地域 |
LNP THERMOCOMP 2X95787 compound is based on Ethylene Tetrafluoroethylene (ETFE) resin containing 15% glass fiber.
|
| LNP™ THERMOCOMP™ Compound 2X98703 | アジア太平洋地域 |
LNP THERMOCOMP 2X98703 compound is based on Ethylene Tetrafluoroethylene (ETFE) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.
|
| LNP™ THERMOCOMP™ Compound 2Z004 | アジア太平洋地域 |
LNP THERMOCOMP 2Z004 compound is based on Ethylene Tetrafluoroethylene (ETFE) resin containing 20% milled glass.
|
| LNP™ THERMOCOMP™ Compound 5C003 | アジア太平洋地域 |
LNP THERMOCOMP 5C003 compound is based on Polyvinylidene Fluoride (PVDF) resin containing 15% carbon fiber. Added features of this grade include: Electrically Conductive.
|
| LNP™ THERMOCOMP™ Compound 5C004 | アジア太平洋地域 |
LNP THERMOCOMP 5C004 compound is based on Polyvinylidene Fluoride (PVDF) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.
|
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