Description Teflon ™ FFR 430 fluoroplastic foam resin has been developed with a superior nucleant package to provide improved foam cell structure and a broader processing window. It has the lowest melt flow (7) of the FFR resins, making it best suited for the larger plenum coax cables, particularly when lowest smoke generation is a key design consideration. The foamed insulation of Teflon ™ FFR 430 fluoroplastic foam resin provides high-speed data transmission with minimal distortion and good cable structural return loss with reduced attenuation. Teflon ™ FFR 430 offers cable designers opportunities for reducing cable size with cable weight savings or the use of larger conductors to construct low-loss cables, without the need for increased dielectric dimensions. This resin is supplied as white pellets and is used in a nitrogen gas-injected foam extrusion process to produce uniform foam cells in the insulation. Achievable cell size and void content will vary based on wall thickness and processing conditions.

Description Teflon ™ FFR 550 is a fluoroplastic resin compounded with a foam nucleating package. This resin is supplied as white pellets and is used in a nitrogen gas-injected foam extrusion process to produce uniform foam cells in the dielectric insulation. Foaming the fluoroplastic reduces its dielectric constant, providing opportunities for miniaturization and weight savings. Foamed insulation of Teflon ™ FFR 550 produces cables for high frequency signal transmission with minimal distortion. Teflon ™ FFR 550 is ideal for producing coaxial cable cores in a broad range of sizes. A typical coaxial cable core would have conductor sizes of 30 AWG or greater, wall thickness of 0.010 in or greater, with void content from 20% to 60%. These voids are closed cell in nature and range from 0.0007 in (0.018 mm) to 0.005 in (0.127 mm) in diameter. Achievable void content will vary based on wall thickness and processing conditions.

Description Teflon ™ FFR 750 is a fluoroplastic resin compounded with a foam nucleating package. This resin is supplied as white pellets and is used in a nitrogen gas-injected foam extrusion process to produce uniform foam cells in the dielectric insulation. Foaming the fluoroplastic reduces its dielectric constant, providing opportunities for miniaturization and weight savings. Foamed insulation of Teflon ™ FFR 750 produces cables for high frequency signal transmission with minimal distortion. Teflon ™ FFR 750 is ideal for producing coaxial cable cores in a broad range of sizes. A typical coaxial cable core would have conductor sizes of 30 AWG or greater, wall thickness of 0.010 in or greater, with void content from 20% to 60%. These voids are closed cell in nature and range from 0.0007 in (0.018 mm) to 0.005 in (0.127 mm) in diameter. Achievable void content will vary based on wall thickness and processing conditions.

Description Teflon ™ FFR 770 is a fluoroplastic resin compounded with a foam nucleating package. This resin is supplied as white pellets and is used in a nitrogen gas-injected foam extrusion process to produce uniform foam cells in the dielectric insulation. Foaming the fluoroplastic reduces its dielectric constant, providing opportunities for miniaturization and weight savings. Foamed insulation of Teflon ™ FFR 770 produces cables for high frequency signal transmission with minimal distortion. Teflon ™ FFR 770 is ideal for producing foamed primary dielectric insulation for twisted pair cables and miniature coaxial cables. A typical cable core would have conductor sizes of 32 AWG or greater, wall thickness of 0.004 in or greater, with void content from 20% to 65%. These voids are closed cell in nature and range from 0.0007 in (0.018 mm) to 0.0013 in (0.033 mm) in diameter. Achievable void content will vary based on wall thickness and processing conditions.

Description Teflon ™ FFR 880 fluoroplastic foam resin was developed to meet the demand for superior micro-coaxial designs required for manufacturing compact electronic devices. Foamed insulation of Teflon ™ FFR 880 fluoroplastic foam resin provides high-speed data transmissions with minimal distortion and exceptional signal return loss and attenuation performance in ultra-thin wire and cable applications. In addition, the resin’s high thermal stability and melt flow rate (nominal MFR of 42) allow for high processing speeds and excellent heat resistance. Teflon ™ FFR 880 fluoroplastic foam resin offers cable designers opportunities for miniaturization and weight savings or the use of larger conductors to construct low-loss cables, without the need for increased dielectric dimensions. Teflon ™ FFR 880 has been compounded with a proprietary foam nucleating package and is supplied as white pellets. This resin is used in a nitrogen gas-injected foam extrusion process to produce uniform foam cells in the dielectric insulation. In micro-coaxial cables using Teflon ™ FFR 880 fluoroplastic foam resin, a typical cable core would have conductor sizes of 26 AWG or smaller, wall thickness of 0.002 in or greater, with void content up to 55%. These voids are closed cell in nature and range from 0.0002 in (0.006 mm) to 0.0013 in (0.033 mm) in diameter. Achievable cell size and void content will vary based on wall thickness and processing conditions.