乙缩醛 (Acetal) by Vamp Tech
产品 | 可用性 | 产品说明 |
---|---|---|
DENIFORM 0037 ST | 北美洲 |
POM resin unfilled, impact modified for injection moulding
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DENIFORM 0037 | 北美洲 |
POM resin unfilled, impact modified for injection moulding
|
DENIFORM 1010 | 北美洲 |
POM resin, 10% glass fiber reinforced for injection moulding
|
DENIFORM 13 | 北美洲 |
POM resin unfilled for injection moulding
|
DENIFORM 2010 | 北美洲 |
POM resin, 20% glass fiber reinforced for injection moulding
|
DENIFORM 2015 | 北美洲 |
POM resin, 20% glass beads for injection moulding
|
DENIFORM 3010 | 北美洲 |
POM resin, 30% glass fiber reinforced for injection moulding
|
DENIFORM 9 | 北美洲 |
POM resin unfilled for injection moulding
|
DENILUB M 00U 01TFMo | 北美洲 |
POM resin unfilled with improved slip and wear properties for injection moulding
|
DENILUB M 00U 0Mo | 北美洲 |
POM copolymer resin unfilled with improved wear properties for injection moulding
|
DENILUB M 00U 0Si | 北美洲 |
POM copolymer resin unfilled with improved slip properties for injection moulding
|
DENILUB M 00U 20TFSi | 北美洲 |
POM copolymer resin unfilled with improved slip properties for injection moulding
|
DENILUB M 00U 40TFSi | 北美洲 |
POM resin unfilled with improved slip properties for injection moulding
|
DENILUB M 00U 4TF | 北美洲 |
POM resin unfilled with improved slip properties for injection moulding
|
DENISTAT M 00U 05 | 北美洲 |
POM resin, unfilled, semiconductive for injection moulding
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