聚酯酰亚胺 (PEI): PEI
产品 | 可用性 | 产品说明 |
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LNP™ STAT-KON™ Compound EX01407C | 北美洲 |
LNP STAT-KON EX01407C compound is based on Polyetherimide (PEI) resin containing carbon fiber and PTFE. Added features of this grade include: LNP Clean Compounding Technology, Electrically Conductive.
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LNP™ STAT-KON™ Compound EX02598C | 北美洲 |
LNP STAT-KON EX02598C compound is based on Polyetherimide (PEI) resin containing carbon nanotube. Added features of this grade include: LNP Clean Compounding Technology, Electrically Conductive.
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LNP™ STAT-KON™ Compound EX03319C | 北美洲 |
LNP STAT-KON EX03319C compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber. Added features of this grade include: LNP Clean Compounding Technology, Low Non-Volatile Residue (NVR), Electrically Conductive
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LNP™ STAT-KON™ Compound EX07311P | 北美洲 |
LNP STAT-KON EX07311P compound is based on Polyetherimide (PEI) resin containing carbon fiber (15%), glass fiber (25%) and PTFE. Added features of this grade include: LNP Clean Compounding Technology, Electrically Conductive, Dimensional Stability, Wear Resistant.
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LNP™ STAT-KON™ Compound EX11318C | 北美洲 |
LNP STAT-KON EX11318C compound is based on Polyetherimide (PEI) resin containing 30% carbon fiber. Added features of this grade include: LNP Clean Compounding Technology, Low C18-C40 Hydrocarbons, Electrically Conductive, Dimensional Stability.
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LNP™ STAT-KON™ Compound EX11402R | 北美洲 |
LNP STAT-KON EX11402R compound is based on Polyetherimide (PEI) resin containing proprietary fillers. Added features of this grade include: Electrically Conductive, Radar Absorbing.
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LNP™ STAT-KON™ Compound EX12310C | 北美洲 |
LNP STAT-KON EX12310C compound is based on Polyetherimide (PEI) resin containing 10% carbon fiber. Added features of this grade include: LNP Clean Compounding Technology, Low C18-C40 Hydrocarbons, Electrically Conductive, Dimensional Stability.
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LNP™ STAT-KON™ Compound EX99689C | 北美洲 |
LNP STAT-KON EX99689C compound is based on Polyetherimide (PEI) resin containing 10% carbon fiber. Added features of this grade include: LNP Clean Compounding Technology, Electrically Conductive.
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LNP™ STAT-KON™ Compound UC1200 | 北美洲 |
LNP STAT-KON UC1200 compound is based on Polyetherimide (PEI) resin containing 12% carbon fiber. Added features of this grade include: Electrically Conductive.
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LNP™ THERMOCOMP™ AM Compound EC004EXAR1 | 北美洲 |
LNP THERMOCOMP EC004EXAR1 compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber designed to provide a Wider Process Window and Easier Flow for Large Format Additive Manufacturing (LFAM) applications needing High heat performance. PEI compounds, based on SABIC's inherently flame-retardant ULTEM™ resins, provide Low Thermal Expansion, High Temperature Performance, Excellent Strength-to-Weight Ratio, High Modulus and Low Creep.
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LNP™ THERMOCOMP™ AM Compound EC004XXAR1 | 北美洲 |
LNP THERMOCOMP EC004XXAR1 is a compound based on Polyetherimide (PEI) resin containing 20% carbon fiber for Large Format Additive manufacturing (LFAM) applications needing higher stiffness vs glass fiber. PEI compounds, based on SABIC's inherently flame-retardant ULTEM™ resins, provide low thermal expansion, high temperature performance, excellent strength-to-weight ratio, high modulus and low creep.
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LNP™ THERMOCOMP™ AM Compound EF004XXAR1 | 北美洲 |
LNP THERMOCOMP EF004XXAR1 is a compound based on Polyetherimide (PEI) resin containing 20% glass fiber for Large Format Additive manufacturing (LFAM) applications. PEI compounds, based on SABIC's inherently flame-retardant ULTEM™ resins, provide low thermal expansion, high temperature performance, excellent strength-to-weight ratio, high modulus and low creep.
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LNP™ THERMOCOMP™ AM Compound EZ006EXAR1 | 北美洲 |
LNP THERMOCOMP EZ006EXAR1is a compound based on Polyetherimide (PEI) resin containing 30% milled glass fiber for Large Format Additive manufacturing (LFAM) applications requiring better dimensional stability and low thermal expansion. PEI compounds, based on SABIC's inherently flame-retardant ULTEM™ resins, offer high temperature performance, excellent strength-to-weight ratio, high modulus and low creep.
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LNP™ THERMOCOMP™ Compound 9X99089 | 北美洲 |
LNP THERMOCOMP 9X99089 compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.
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LNP™ THERMOCOMP™ Compound EC004APQ | 北美洲 |
LNP THERMOCOMP EC004APQ compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive, FAR25.853 Compliant.
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LNP™ THERMOCOMP™ Compound EC004XXC | 北美洲 |
LNP THERMOCOMP EC004XXC compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.
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LNP™ THERMOCOMP™ Compound EC005 - Americas | 北美洲 |
LNP THERMOCOMP EC005 compound is based on Polyetherimide (PEI) resin containing 25% carbon fiber. Added features of this grade include: Electrically Conductive.
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LNP™ THERMOCOMP™ Compound EC005 - Asia | 亚太地区 |
LNP THERMOCOMP EC005 compound is based on Polyetherimide (PEI) resin containing 25% carbon fiber. Added features of this grade include: Electrically Conductive.
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LNP™ THERMOCOMP™ Compound EC005 - Europe | 欧洲 |
LNP THERMOCOMP EC005 compound is based on Polyetherimide (PEI) resin containing 25% carbon fiber. Added features of this grade include: Electrically Conductive.
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LNP™ THERMOCOMP™ Compound EC006 - Americas | 北美洲 |
LNP THERMOCOMP EC006 compound is based on Polyetherimide (PEI) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive.
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LNP™ THERMOCOMP™ Compound EC006 - Asia | 亚太地区 |
LNP THERMOCOMP EC006 compound is based on Polyetherimide (PEI) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive.
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LNP™ THERMOCOMP™ Compound EC006 - Europe | 欧洲 |
LNP THERMOCOMP EC006 compound is based on Polyetherimide (PEI) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive.
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LNP™ THERMOCOMP™ Compound EC006APQ | 北美洲 |
LNP THERMOCOMP EC006APQ compound is based on Polyetherimide (PEI) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive, High Flow, FAR25.853 Compliant.
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LNP™ THERMOCOMP™ Compound EC006AQW | 北美洲 |
LNP THERMOCOMP EC006AQW compound is based on Polyetherimide (PEI) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive. This grade has been pre-assessed and passed the material related tests from the ISO 10993 “Biological Evaluation of Medical Devices”.
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LNP™ THERMOCOMP™ Compound EC006E | 北美洲 |
LNP THERMOCOMP EC006E compound is based on Polyetherimide (PEI) resin containing 30% carbon fiber. Added features of this grade include: Easy Molding, Electrically Conductive.
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LNP™ THERMOCOMP™ Compound EC006PXQ | 北美洲 |
LNP THERMOCOMP EC006PXQ compound is based on Polyetherimide (PEI) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive, Exceptional Processing, FAR25.853 Compliant.
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LNP™ THERMOCOMP™ Compound EC008 | 北美洲 |
LNP THERMOCOMP EC008 compound is based on Polyetherimide (PEI) resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive.
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LNP™ THERMOCOMP™ Compound EC008APQ | 北美洲 |
LNP THERMOCOMP EC008APQ compound is based on Polyetherimide (PEI) resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive, High Flow. FAR25.853 Compliant.
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LNP™ THERMOCOMP™ Compound EC008PXQ | 北美洲 |
LNP THERMOCOMP EC008PXQ compound is based on Polyetherimide (PEI) resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive, Exceptional Processing, FAR25.853 Compliant.
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LNP™ THERMOCOMP™ Compound ECF62 | 北美洲 |
LNP THERMOCOMP ECF62 compound is based on Polyetherimide (PEI) resin containing 30% glass fiber, 10% carbon fiber. Added features of this grade include: Electrically Conductive.
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LNP™ THERMOCOMP™ Compound EF002EXH | 北美洲 |
LNP THERMOCOMP EF002EXH compound is based on Polyetherimide (PEI) resin containing 10% glass fiber. Added features of this grade include: Healthcare.
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LNP™ THERMOCOMP™ Compound EF004 | 北美洲 |
LNP THERMOCOMP EF004 compound is based on Polyetherimide (PEI) resin containing 20% glass fiber.
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LNP™ THERMOCOMP™ Compound EF004XXP | 北美洲 |
LNP THERMOCOMP EF004XXP compound is based on Polyetherimide (PEI) resin containing 20% glass fiber. Added features of this grade include: High Modulus, High Strength, Good Dimension Stability and Good Warpage Control.
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LNP™ THERMOCOMP™ Compound EF006 - Americas | 北美洲 |
LNP THERMOCOMP EF006 compound is based on Polyetherimide (PEI) resin containing 30% glass fiber.
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LNP™ THERMOCOMP™ Compound EF006 - Europe | 欧洲 |
LNP THERMOCOMP EF006 compound is based on Polyetherimide (PEI) resin containing 30% glass fiber.
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LNP™ THERMOCOMP™ Compound EF006ER | 北美洲 |
LNP THERMOCOMP EF006ER compound is based on Polyetherimide (PEI) resin containing 30% glass fiber. Added features of this grade include: Easy Molding, Mold Release.
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LNP™ THERMOCOMP™ Compound EF006H | 北美洲 |
LNP THERMOCOMP EF006H compound is based on Polyetherimide (PEI) resin containing 30% glass fiber. Added features of this grade include: Healthcare.
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LNP™ THERMOCOMP™ Compound EFB26ER | 北美洲 |
LNP THERMOCOMP EFB26ER compound is based on Polyetherimide (PEI) resin containing 30% glass fiber, 10% glass bead. Added features of this grade include: Easy Molding, Mold Release.
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LNP™ THERMOCOMP™ Compound EX00781H - Americas | 北美洲 |
LNP THERMOCOMP EX00781H is a compound is based on Polyetherimide (PEI) resin containing 20% glass fiber. Added features of this grade include: Healthcare.
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LNP™ THERMOCOMP™ Compound EX00781H - Asia | 亚太地区 |
LNP THERMOCOMP EX00781H is a compound is based on Polyetherimide (PEI) resin containing 20% glass fiber. Added features of this grade include: Healthcare.
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