热塑性，未指定(TP，未指定) by Compounding Solutions
| 产品 | 可用性 | 产品说明 |
|---|---|---|
| ReZalloy Rx™ 1135 | Amérique du Nord |
ReZalloy Rx 1135 provides low modulus properties and exceptional bonding performance. ReZalloy Rx 1135 is capable of bonding to polar substrates such as PEBA, TPU, COPE, SBC, PC, ABS, PET, etc.
|
| ReZalloy Rx™ 1140 | Amérique du Nord |
ReZalloy Rx 1140 provides low modulus properties and exceptional bonding performance. ReZalloy Rx 1140 is capable of bonding to polar substrates such as PEBA, TPU, COPE, SBC, PC, ABS, PET, etc.
|
| ReZalloy Rx™ 1140-LV | Amérique du Nord |
ReZalloy Rx 1140-LV provides low modulus properties and exceptional bonding performance. ReZalloy Rx 1140-LV is capable of bonding to polar substrates such as PEBA, TPU, COPE, SBC, PC, ABS, PET, etc.
|
| ReZalloy Rx™ 1150 | Amérique du Nord |
ReZalloy Rx 1150 provides low modulus properties and exceptional bonding performance. ReZalloy Rx 1150 is capable of bonding to polar substrates such as PEBA, TPU, COPE, SBC, PC, ABS, PET, etc.
|
| ReZalloy Rx™ 1160 | Amérique du Nord |
ReZalloy Rx 1160 provides low modulus properties and exceptional bonding performance. ReZalloy Rx 1160 is capable of bonding to polar substrates such as PEBA, TPU, COPE, SBC, PC, ABS, PET, etc.
|
1
1
