Thermoplastic Elastomer (TPE): エラストマー、特殊
产品 | 可用性 | 产品说明 |
---|---|---|
DynaMix™ 604A | 北アメリカ |
Acetal Elastomer
Features:
- Excellent Chemical Resistance
- Low Temperature Impact Resistance
- Excellent Processability
- Good Creep Resistance
Applications:
- Automotive
- Sporting Goods
- Tubing/Hoses
- Industrial
|
Generic Elastomer, Specialty | アジア太平洋地域 |
This data represents typical values that have been calculated from all products classified as: Generic Elastomer, Specialty
This information is provided for comparative purposes only.
|
Kimura® K13X | アジア太平洋地域 |
A dark brown high performance polymer containing a unique self- reinforcing polymer structure, developed specifically for critical semiconductor applications. The high purity of the polymer combined with the absence of any fillers makes this polymer suitable for processes involving lower feature sizes. This material has a low coefficient of thermal expansion, low compression set and has an extremely low etch rate in aggressive plasma environments.
Key Attributes
- Exceptionally pure - does not contain any fillers which may cause particulation problems.
- Outstanding plasma resistance - ideal for Chlorine, Fluorine & Oxygen chemistries.
- Exceptionally low plasma etch rate
- Low thermal expansion
- Retro-fits existing O-ring grooves (including FKM & FFKM grooves)
- Low permeation
- Low out-gassing
- Low adhesion (reduced sticking)
- Low friction, high strength and high modulus make K13X ideal for constant force dynamic applications.
Typical Applications
- Dynamic seals
- Static seals
- Wafer-handling products
|
Kimura® K23X | アジア太平洋地域 |
A brown coloured high performance polymer containing a unique self- reinforcing polymer structure, developed specifically for aggressive semiconductor applications. The high purity of the polymer combined with the absence of any fillers makes this polymer suitable for processes involving lower feature sizes. This material has a low coefficient of thermal expansion, low compression set and has an extremely low etch rate in aggressive plasma environments.
Kimura® K23X can be fully moulded into custom shapes and O-rings (from 6.07mm/0.24" ID & 1.78mm/0.07" CS up to 600mm/23.6" ID & 10mm/0.39" CS).
Key Attributes
- Exceptionally pure - does not contain any fillers which may cause particulation problems.
- Low modulus ensures excellent sealing characteristics
- Outstanding plasma resistance - ideal for Chlorine, Fluorine & Oxygen chemistries.
- Exceptionally low plasma etch rate
- Low thermal expansion
- Retro-fits existing O-ring grooves (including FKM & FFKM grooves)
- Low permeation
- Low out-gassing
- Low adhesion (reduced sticking)
Typical Applications
- Dynamic seals
- Static seals
- Wafer-handling products
|
Kimura® K2CD | アジア太平洋地域 |
A red/brown high performance polymer containing a unique self- reinforcing polymer structure, developed specifically for aggressive semiconductor applications. The high purity of the polymer combined with the absence of any fillers makes this polymer suitable for processes involving lower feature sizes. This material has a low coefficient of thermal expansion, low compression set and has an extremely low etch rate in aggressive plasma environments.
Key Attributes
- Exceptionally pure - does not contain any fillers which may cause particulation problems.
- Outstanding plasma resistance - ideal for Chlorine, Fluorine & Oxygen chemistries.
- Exceptionally low plasma etch rate
- Low thermal expansion
- Retro-fits existing O-ring grooves (including FKM & FFKM grooves)
- Low permeation
- Low out-gassing
- Low adhesion (reduced sticking)
Typical Applications
- Dynamic seals
- Static seals
- Wafer-handling products
|
OLEFISTA™ QE1594 | アジア太平洋地域 | |
OLEFISTA™ QM4301D/QMC292 | アジア太平洋地域 | |
OLEFISTA™ QM4301E/QCM292 | アジア太平洋地域 | |
OLEFISTA™ QU1549A | アジア太平洋地域 | |
OLEFISTA™ QX0227L/QCM292 | アジア太平洋地域 | |
OLEFISTA™ QX0238B | アジア太平洋地域 | |
OLEFISTA™ QX0238C | アジア太平洋地域 | |
OLEFISTA™ QX0238D | アジア太平洋地域 | |
OLEFISTA™ QX0238E | アジア太平洋地域 | |
OLEFISTA™ QX1219D/QCM292 | アジア太平洋地域 |