热塑性弹性体(TPE) by EMPILON
产品 | 可用性 | 产品说明 |
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EMPILON® HA272 | 亚太地区 |
EMPILON® HAR series compound are specially designed for over-molding with engineering plastic such as ABS, PC, Nylon, PETG, PBT etc. which are commonly use in the 3C industry (Computer, Communication and Consumer electronics) as well as hand held device products for soft touch, anti-slip & vibration functional purposes. Hydrogenated Styrenic Block Copolymer is the main content of this HAR series compound, its hardness range is from Shore A 39 ~ Shore 85. They can be processed by double injection and co-extrusion machines or ordinary plastic injection machines with an insert molding process.
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EMPILON® HA359 | 北美洲 | |
EMPILON® HA40 | 亚太地区 |
EMPILON® HAR series compound are specially designed for over-molding with engineering plastic such as ABS, PC, Nylon, PETG, PBT etc. which are commonly use in the 3C industry (Computer, Communication and Consumer electronics) as well as hand held device products for soft touch, anti-slip & vibration functional purposes. Hydrogenated Styrenic Block Copolymer is the main content of this HAR series compound, its hardness range is from Shore A 39 ~ Shore 85. They can be processed by double injection and co-extrusion machines or ordinary plastic injection machines with an insert molding process.
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EMPILON® HA50 | 亚太地区 |
EMPILON® HAR series compound are specially designed for over-molding with engineering plastic such as ABS, PC, Nylon, PETG, PBT etc. which are commonly use in the 3C industry (Computer, Communication and Consumer electronics) as well as hand held device products for soft touch, anti-slip & vibration functional purposes. Hydrogenated Styrenic Block Copolymer is the main content of this HAR series compound, its hardness range is from Shore A 39 ~ Shore 85. They can be processed by double injection and co-extrusion machines or ordinary plastic injection machines with an insert molding process.
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EMPILON® HA60 | 亚太地区 |
EMPILON® HAR series compound are specially designed for over-molding with engineering plastic such as ABS, PC, Nylon, PETG, PBT etc. which are commonly use in the 3C industry (Computer, Communication and Consumer electronics) as well as hand held device products for soft touch, anti-slip & vibration functional purposes. Hydrogenated Styrenic Block Copolymer is the main content of this HAR series compound, its hardness range is from Shore A 39 ~ Shore 85. They can be processed by double injection and co-extrusion machines or ordinary plastic injection machines with an insert molding process.
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EMPILON® HA70 | 亚太地区 |
EMPILON® HAR series compound are specially designed for over-molding with engineering plastic such as ABS, PC, Nylon, PETG, PBT etc. which are commonly use in the 3C industry (Computer, Communication and Consumer electronics) as well as hand held device products for soft touch, anti-slip & vibration functional purposes. Hydrogenated Styrenic Block Copolymer is the main content of this HAR series compound, its hardness range is from Shore A 39 ~ Shore 85. They can be processed by double injection and co-extrusion machines or ordinary plastic injection machines with an insert molding process.
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EMPILON® HA80 | 亚太地区 |
EMPILON® HAR series compound are specially designed for over-molding with engineering plastic such as ABS, PC, Nylon, PETG, PBT etc. which are commonly use in the 3C industry (Computer, Communication and Consumer electronics) as well as hand held device products for soft touch, anti-slip & vibration functional purposes. Hydrogenated Styrenic Block Copolymer is the main content of this HAR series compound, its hardness range is from Shore A 39 ~ Shore 85. They can be processed by double injection and co-extrusion machines or ordinary plastic injection machines with an insert molding process.
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EMPILON® HB60 | 亚太地区 |
EMPILON® HAR series compound are specially designed for over-molding with engineering plastic such as ABS, PC, Nylon, PETG, PBT etc. which are commonly use in the 3C industry (Computer, Communication and Consumer electronics) as well as hand held device products for soft touch, anti-slip & vibration functional purposes. Hydrogenated Styrenic Block Copolymer is the main content of this HAR series compound, its hardness range is from Shore A 39 ~ Shore 85. They can be processed by double injection and co-extrusion machines or ordinary plastic injection machines with an insert molding process.
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EMPILON® HP65 | 亚太地区 |
EMPILON® HAR series compound are specially designed for over-molding with engineering plastic such as ABS, PC, Nylon, PETG, PBT etc. which are commonly use in the 3C industry (Computer, Communication and Consumer electronics) as well as hand held device products for soft touch, anti-slip & vibration functional purposes. Hydrogenated Styrenic Block Copolymer is the main content of this HAR series compound, its hardness range is from Shore A 39 ~ Shore 85. They can be processed by double injection and co-extrusion machines or ordinary plastic injection machines with an insert molding process.
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