Nemcon™ H ES DP110/X3
Typical Applications
- Housings for power components.
- Encapsulation/housings for bobbins, actuators, and coils.
- IC thermal management components, such as heat sinks, heat spreaders, or heat pipes.
- LED lighting assemblies.
一般属性
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加工
Find specific processing information for Nemcon™ H Thermally Conductive Compounds as well as general information for the 聚碳酸脂合金 generic family. 注册 或 登录 了解更多信息。