50-1225 is a low viscosity, room temperature curing silicone potting and encapsulating compound. When cured, this material forms a soft, highly flexible, flame retardant, and thermally conductive package.

50-1225 can be used for potting or encapsulating electronic packages that have sensitive components. Due to its low stress during and after cure, this material will not crush or damage delicate components. This silicone system will maintain its low durometer through aging and thermal cycling.

50-1225 provides high heat transfer and does not require a post cure. It may be used immediately after curing at operating temperatures of -65°C to 210°C.

Features:
- Flexible
- Thermally conductive
- Solvent free
- Deep section curing (beyond 1-2 inches)
- high operating temperatures

Benefits:
- Low stress on components and vibration resistant
- Quick heat dissipation extends electronic life
- No by-products released during cure and safe to handle
- No need for multiple pours
- Good protection in extreme environmental applications