Plaskon SMT-B-1LAS
This material is an epoxy molding compound optimized specifically for grid arrays (BGA/LGA) requiring low alpha particle count. It has the same unique resin system as the SMT-B-1, which minimizes warpage and enables trouble-free molding onto rigid and flexible laminate substrates. An all-spherical filler system ensures outstanding moldability both with automated and conventional molding systems. Minimal dimensional change after molding, post bake and subsequent solder treatment make this compound an excellent choice for grid array applications.
一般属性
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物料形态
已商用：当前有效
可用性
北美洲
加工方式
树脂传递成型
其他属性
特性, 形式, 密度 / 比重, 流动方向收缩, 弯曲模量, 弯曲强度, 玻璃转化温度, CLTE，流动, 导热系数, 体积电阻率, 介电强度, 介电常数, 耗散因数, UL 阻燃等级, 极限氧指数, 补充信息, 注射说明
加工
Find specific processing information for Plaskon as well as general information for the 环氧; 环氧树脂 generic family. 注册 或 登录 了解更多信息。
