URE-BOND® 90
Ure-Bond™ 90 is a two component, slightly expanding urethane adhesive that offers a strong, rigid bond between urethane modeling board surfaces, up to 30# density. It will also bond segments of EPS foam.
It slightly expands to fill gaps, holes and micro cracks between board segments for level, predictable bonding. Ure-Bond™ 90 is machinable in 4 hours and sands uniformly to minimize or eliminate post finishing.
Ure-Bond™ 90 is also ideal for bonding a variety of other porous and non-porous, rigid substrates.
The mix ratio is 1A:1B by volume, pot life is 8 minutes, machining time is 4 hours and full cure time is 16 hours at room temperature (73°F / 23°C).
It slightly expands to fill gaps, holes and micro cracks between board segments for level, predictable bonding. Ure-Bond™ 90 is machinable in 4 hours and sands uniformly to minimize or eliminate post finishing.
Ure-Bond™ 90 is also ideal for bonding a variety of other porous and non-porous, rigid substrates.
The mix ratio is 1A:1B by volume, pot life is 8 minutes, machining time is 4 hours and full cure time is 16 hours at room temperature (73°F / 23°C).
一般属性
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物料形态
已商用：当前有效
文档
description
Technical Datasheet (English)
下载文档可用性
北美洲, 非洲和中东, 拉丁美洲, 欧洲, 亚太地区
用途
修复材料
其他属性
特性, 外观, 密度 / 比重, 肖氏硬度, 热固组件, 储存稳定性, 热固性混合粘度, 其他性能
加工
Find specific processing information for URE-BOND® as well as general information for the 聚氨酯，未指定 generic family. 注册 或 登录 了解更多信息。
