SUMIKASUPER® E5008
SUMIKASUPER E5008 is a Liquid Crystal Polymer (LCP) product filled with glass fiber. It is available in Asia Pacific, Europe, Latin America, or North America for injection molding.
E5000 series are distinguished by their ultrahigh heat resistance and ability to maintain stiffness and strength at temperature above 200°C, meaning they can be used for high-temperature surface-mount reflow soldering. E5000 Series grades are typically processed at 400°C.
E5008 is a 40% glass fiber grade with ultra-high heat resistance, low CLTE and Sealed relay covers/cases and relay bases. E5008 is used for injection molded bobbins of various types as well as sealed-cover relays and relay cases, lamp holders/sockets, office printer components, and engine peripheral parts (e.g., insulation board).
E5000 series are distinguished by their ultrahigh heat resistance and ability to maintain stiffness and strength at temperature above 200°C, meaning they can be used for high-temperature surface-mount reflow soldering. E5000 Series grades are typically processed at 400°C.
E5008 is a 40% glass fiber grade with ultra-high heat resistance, low CLTE and Sealed relay covers/cases and relay bases. E5008 is used for injection molded bobbins of various types as well as sealed-cover relays and relay cases, lamp holders/sockets, office printer components, and engine peripheral parts (e.g., insulation board).
一般属性
使用 Prospector 建立免費帳戶時，可造訪 SUMIKASUPER® E5008 的完整資料表詳細資訊。您將找到有關物理、機械和硬度規格的完整資訊
物料形态
Commercial: Active
文档
description
Contact Information (English)
下载文档
layers
檢視超過 3 個文件
Download More Documents可用性
Asia Pacific, Europe, Latin America, North America
用途
Automotive Applications
加工方式
Injection Molding
其他属性
Filler / Reinforcement, Features, UL File Number, Appearance, Forms, Part Marking Code, Density / Specific Gravity, Density, Mold Shrink, Linear-Flow, Mold Shrink, Linear-Trans, Water Absorption @ 24 hrs, Tensile Modulus, Tensile Strength, Tensile Stress, Tensile Elongation at Break, Tensile Strain at Break, Flexural Modulus, Flexural Modulus, Flexural Strength, Flexural Stress, Charpy Unnotched Impact Strength, Unnotched Izod Impact, Unnotched Izod Impact Strength, Rockwell Hardness, DTUL (264 psi) - Unannealed, DTUL (1.80 MPa) Unannealed, Coefficient of Linear Thermal Expansion, Flow, Coefficient of Linear Thermal Expansion, Transverse, Volume Resistivity, Electric Strength, Relative Permittivity, Dissipation Factor, Arc Resistance, Comparative Tracking Index, Flammability Classification, Drying Temperature, Drying Time, Rear Temperature, Middle Temperature, Front Temperature, Nozzle Temperature, Processing (Melt) Temp, Mold Temperature, Injection Pressure, Holding Pressure, Back Pressure, Screw Speed
加工
Find specific processing information for SUMIKASUPER® as well as general information for the Liquid Crystal Polymer generic family. 注册 或 登录 了解更多信息。
