LNP LUBRICOMP LL003XX1 compound is based on Polyetheretherketone (PEEK) resin containing 15% PTFE lubricant. Added features of this grade include: Easy Molding, Excellent Wear Resistance and Very Low Coefficient of Friction (CoF)

LNP LUBRICOMP LL004 compound is based on Polyetheretherketone (PEEK) resin containing 20% PTFE. Added features of this grade include: Wear Resistant.

LNP LUBRICOMP LL004 compound is based on Polyetheretherketone (PEEK) resin containing 20% PTFE. Added features of this grade include: Wear Resistant.

LNP LUBRICOMP LL004 compound is based on Polyetheretherketone (PEEK) resin containing 20% PTFE. Added features of this grade include: Wear Resistant.

LNP LUBRICOMP LL004C compound is based on Polyetheretherketone (PEEK) resin containing 20% PTFE. Added features of this grade include: Wear Resistant, LNP Clean Compounding Technology.

LNP LUBRICOMP LX00430 compound is based on Polyetheretherketone (PEEK) resin containing proprietary fillers. Added features of this grade include: Wear Resistant.

LNP LUBRICOMP LX19222 compound is based on Polyetheretherketone (PEEK) resin containing proprietary fillers. Added features of this grade include: Easy Molding, High Temperature Bearing, Excellent Wear Resistance and Low CTE.

LNP LUBRICOMP LX91475 compound is based on Polyetheretherketone (PEEK) resin containing proprietary fillers. Added features of this grade include: Easy Molding, High Temperature Bearing Grade, Wear Resistant.

LNP LUBRICOMP LX91475 compound is based on Polyetheretherketone (PEEK) resin containing proprietary fillers. Added features of this grade include: Easy Molding, High Temperature Bearing Grade, Wear Resistant.

LNP LUBRICOMP LX91475 compound is based on Polyetheretherketone (PEEK) resin containing proprietary fillers. Added features of this grade include: Easy Molding, High Temperature Bearing Grade, Wear Resistant.

LNP STAT-KON LX00486C compound is based on Polyetheretherketone (PEEK) resin containing carbon fiber. Added features of this grade include: LNP Clean Compounding Technology, Electrically Conductive, Dimensional Stability.

LNP STAT-KON LX00797C compound is based on Polyetheretherketone (PEEK) resin containing carbon fiber. Added features of this grade include: LNP Clean Compounding Technology, Electrically Conductive, Dimensional Stability.

LNP STAT-KON LX04420C compound is based on Polyetheretherketone (PEEK) resin containing carbon fiber. Added features of this grade include: LNP Clean Compounding Technology, Electrically Conductive, Dimensional Stability.

LNP THERMOCOMP LC003E compound is based on Polyetheretherketone (PEEK) resin containing 15% carbon fiber. Added features of this grade include: Easy Molding, Electrically Conductive

LNP THERMOCOMP LC003E compound is based on Polyetheretherketone (PEEK) resin containing 15% carbon fiber. Added features of this grade include: Easy Molding, Electrically Conductive

LNP THERMOCOMP LC004XXP compound is based on Polyetheretherketone (PEEK) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.

LNP THERMOCOMP LC006 compound is based on Polyetheretherketone (PEEK) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive.

LNP THERMOCOMP LC006 compound is based on Polyetheretherketone (PEEK) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive.

LNP THERMOCOMP LC006EX1 compound is based on Polyetheretherketone (PEEK) resin containing 30% post-industrial-recycled (PIR) carbon fiber. Added features of this grade include High Modulus, High impact, Easy Molding and Electrically Conductive.

LNP THERMOCOMP LC006EXQ compound is based on Polyetheretherketone (PEEK) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive, Easy Molding.

LNP THERMOCOMP LC008E compound is based on Polyetheretherketone (PEEK) resin containing 40% carbon fiber. Added features of this grade include: Easy Molding, Electrically Conductive.

LNP THERMOCOMP LC008E compound is based on Polyetheretherketone (PEEK) resin containing 40% carbon fiber. Added features of this grade include: Easy Molding, Electrically Conductive.

LNP THERMOCOMP LC008EXP compound is based on Polyetheretherketone (PEEK) resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive, Easy Molding.

LNP THERMOCOMP LC008EXQ compound is based on Polyetheretherketone (PEEK) resin containing 40% carbon fiber. Added features of this grade include: Electrically Conductive, Easy Molding.

LNP THERMOCOMP LC00AEX1 compound is based on Polyetheretherketone (PEEK) resin containing 50% carbon fiber. Added features of this grade include: Electrically Conductive, Ultra High Modulus and Strength, Easy Molding, Excellent Wear Resistance and Low CTE.

LNP THERMOCOMP LC00APXQ compound is based on Polyetheretherketone (PEEK) resin containing 50% carbon fiber. Added features of this grade include: Exceptional Processing, Electrically Conductive.

LNP THERMOCOMP LCF62E compound is based on Polyetheretherketone (PEEK) resin containing 10% carbon fiber and 30% glass fiber. Added features of this grade include: Easy Molding, Electrically Conductive.

LNP THERMOCOMP LCF62E compound is based on Polyetheretherketone (PEEK) resin containing 10% carbon fiber and 30% glass fiber. Added features of this grade include: Easy Molding, Electrically Conductive.

LNP THERMOCOMP LCF62E compound is based on Polyetheretherketone (PEEK) resin containing 10% carbon fiber and 30% glass fiber. Added features of this grade include: Easy Molding, Electrically Conductive.

LNP THERMOCOMP LF002 compound is based on Polyetheretherketone (PEEK) resin containing 10% glass fiber.

LNP THERMOCOMP LF002 compound is based on Polyetheretherketone (PEEK) resin containing 10% glass fiber.

LNP THERMOCOMP LF002EXD-WT02005 compound is based on Polyetheretherketone (PEEK) resin containing 10% glass fiber. Added features of this grade include Custom Color and Easy Molding.

LNP THERMOCOMP LF002XXP-WT02005 compound is based on Polyetheretherketone (PEEK) resin containing 10% glass fiber. Added features of this grade include: Custom Color.

LNP THERMOCOMP LF003 compound is based on Polyetheretherketone (PEEK) resin containing 15% glass fiber.

LNP THERMOCOMP LF004E compound is based on Polyetheretherketone (PEEK) resin containing 20% glass fiber. Added features of this grade include: Easy Molding.

LNP THERMOCOMP LF004E compound is based on Polyetheretherketone (PEEK) resin containing 20% glass fiber. Added features of this grade include: Easy Molding.

LNP THERMOCOMP LF004E compound is based on Polyetheretherketone (PEEK) resin containing 20% glass fiber. Added features of this grade include: Easy Molding.

LNP THERMOCOMP LF004E1 compound is based on Polyetheretherketone (PEEK) resin containing 20% glass fiber. Added features of this grade include: Easy Molding and Low Warpage

LNP THERMOCOMP LF006 compound is based on Polyetheretherketone (PEEK) resin containing 30% glass fiber.

LNP THERMOCOMP LF006 compound is based on Polyetheretherketone (PEEK) resin containing 30% glass fiber.